Patents by Inventor Michael Brazel

Michael Brazel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
    Publication number: 20170178994
    Abstract: Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled to the first heater trace in the IC package support structure.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 22, 2017
    Applicant: Intel Corporation
    Inventors: Michael Hui, Rashelle Yee, Jonathan Thibado, Daniel P. Carter, Shelby Ferguson, Anthony P. Valpiani, Russell S. Aoki, Jonathon Robert Carstens, Joseph J. Jasniewski, Harvey R. Kofstad, Michael Brazel, Tracy Clack, Viktor Vogman, Penny Woodcock, Kevin J. Ceurter, Hongfei Yan