Patents by Inventor Michael Brigham

Michael Brigham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liner-free through-silicon-vias formed by selective metal deposition
    Patent number: 12381129
    Abstract: Structures for a through-silicon via and methods of forming a structure for a through-silicon via. The structure includes a substrate having a trench and surfaces that border the trench. The structure further includes a through-silicon via having a layer inside the trench. The layer is in direct contact with the surfaces of the substrate.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: August 5, 2025
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: David Thomas, Cody Soule, John G. Twombly, Michael Brigham, Bruce Porth, Vivekanand Kalaparthi
  • LINER-FREE THROUGH-SILICON-VIAS FORMED BY SELECTIVE METAL DEPOSITION
    Publication number: 20230307321
    Abstract: Structures for a through-silicon via and methods of forming a structure for a through-silicon via. The structure includes a substrate having a trench and surfaces that border the trench. The structure further includes a through-silicon via having a layer inside the trench. The layer is in direct contact with the surfaces of the substrate.
    Type: Application
    Filed: March 28, 2022
    Publication date: September 28, 2023
    Inventors: David Thomas, Cody Soule, John G. Twombly, Michael Brigham, Bruce Porth, Vivekanand Kalaparthi