Patents by Inventor Michael Brooking

Michael Brooking has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190392150
    Abstract: An administrative agent running at a virtualization host of a network-accessible virtualized computing service determines that a first virtual machine is to be instantiated. The agent initiates at least a first configuration operation to enable connectivity for at least a portion of network traffic associated with the first virtual machine. The first configuration operation is performed at least in part using a first virtualization offloading card of the virtualization host. The agent causes a virtualization intermediary process of the virtualization host to launch one or more execution threads of the virtualization intermediary process to implement the first virtual machine. The intermediary process may be swapped to persistent storage, e.g., based on an analysis of resources of the virtualization host.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 26, 2019
    Applicant: Amazon Technologies, Inc.
    Inventors: Upendra Bhalchandra Shevade, Michael Brooke Furr, Kevin P. Smith, Diwakar Gupta, Anthony Nicholas Liguori, Nishant Mehta
  • Publication number: 20190265996
    Abstract: A number of cells of a control plane of a virtualized computing service are set up, including a first cell with one or more request processing nodes, a local instance of a data store, and metadata indicating a set of virtualization hosts. A request processer transmits a request for a virtual machine to the first cell. A request processor of the cell initiates a workflow to launch the virtual machine using a virtualization host; the workflow includes storing a record of the request in the local instance of the data store.
    Type: Application
    Filed: February 26, 2018
    Publication date: August 29, 2019
    Applicant: Amazon Technologies, Inc.
    Inventors: Upendra Bhalchandra Shevade, Diwakar Gupta, Michael Brooke Furr, Nishant Mehta, Kevin P. Smith
  • Publication number: 20190252281
    Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 15, 2019
    Inventors: Matt E. Schwab, J. Michael Brooks, David J. Corisis
  • Patent number: 10320644
    Abstract: A traffic analyzer of a provider network identifies endpoint categories into which traffic directed to or from a first isolated virtual network of the provider network is to be classified. A first endpoint category includes an endpoint configured in a second isolated virtual network. Using packet-level metrics collected at virtualization management components of virtualization hosts, the traffic analyzer determines the amount of data transmitted between the first isolated virtual network and the various endpoint categories during selected time intervals. The traffic analyzer provides the categorized traffic amounts as input to a predictive model, and stores expected future traffic trends generated by the model.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: June 11, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Po-Chun Chen, Kyle Tailor Akers, Kevin Christopher Miller, Michael Brooke Furr, Christopher Ian Hendrie
  • Patent number: 10312173
    Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: June 4, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Matt E. Schwab, J. Michael Brooks, David J. Corisis
  • Publication number: 20190143225
    Abstract: The present invention provides methods and system of identifying and communicating optimal fantasy sports pick(s). The methods comprise receiving, from one or more individual user(s), requests for entry into a contest; accepting said requests for entry into said contest; initiating said contest; and awarding prizes based on said ranking of users at the end of the contest.
    Type: Application
    Filed: January 10, 2019
    Publication date: May 16, 2019
    Inventors: Ofer Baazov, Michael Brooks
  • Patent number: 10241035
    Abstract: Spectrophotometric sensors for measuring the concentration of various solutions are disclosed. Methods for controlling the introduction of disinfectants using such sensors for water treatment are also disclosed. Hypochlorite strength is monitored in at least some embodiments.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: March 26, 2019
    Assignee: Evoqua Water Technologies LLC
    Inventors: David Macdonald Bonnick, Michael Brooks
  • Publication number: 20190081015
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.
    Type: Application
    Filed: November 14, 2018
    Publication date: March 14, 2019
    Inventors: Matt E. Schwab, David J. Corisis, J. Michael Brooks
  • Patent number: 10220321
    Abstract: The present invention provides methods and system of identifying and communicating optimal fantasy sports pick(s). The methods comprise receiving, from one or more individual user(s), requests for entry into a contest; accepting said requests for entry into said contest; initiating said contest; and awarding prizes based on said ranking of users at the end of the contest.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: March 5, 2019
    Assignee: Fantech Software Inc.
    Inventors: Ofer Baazov, Michael Brooks
  • Patent number: 10194560
    Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: January 29, 2019
    Assignee: Cisco Technology, Inc.
    Inventors: Long Dang, Don Nguyen, Michael Brooks
  • Patent number: 10163826
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: December 25, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Matt E. Schwab, David J. Corisis, J. Michael Brooks
  • Publication number: 20180211896
    Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
    Type: Application
    Filed: March 27, 2018
    Publication date: July 26, 2018
    Inventors: Matt E. Schwab, J. Michael Brooks, David J. Corisis
  • Patent number: 9992210
    Abstract: A system for data communications includes a port scan detector, a decoy port system, a data packet hash manager, an encapsulated artificial intelligence system and an offensive code system configured to implant offensive code in the sending device and to control operation of the sending device if the sending device is the hostile device, if the sending device is not operating the has increment system and if the data communications are not consistent with the levelling algorithm.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: June 5, 2018
    Assignee: MYTH INNOVATIONS, INC.
    Inventors: James Albert Luckett, Jr., Chad Michael Rowlee, Robert Michael Brooks, Jr.
  • Patent number: 9960094
    Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: May 1, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Matt E. Schwab, J. Michael Brooks, David J. Corisis
  • Publication number: 20180071637
    Abstract: The present invention provides methods and system of identifying and communicating optimal fantasy sports pick(s). The methods comprise receiving, from one or more individual user(s), requests for entry into a contest; accepting said requests for entry into said contest; initiating said contest; and awarding prizes based on said ranking of users at the end of the contest.
    Type: Application
    Filed: May 25, 2016
    Publication date: March 15, 2018
    Inventors: Ofer Baazov, Michael Brooks
  • Publication number: 20180040582
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.
    Type: Application
    Filed: October 18, 2017
    Publication date: February 8, 2018
    Inventors: Matt E. Schwab, David J. Corisis, J. Michael Brooks
  • Patent number: 9813379
    Abstract: A request to establish a VPN connection between a customer data center and a set of resources of a provider network is received. A new isolated virtual network (IVN) is established to implement a virtual private gateway to be used for the connection. One or more protocol processing engines (PPEs) are instantiated within the IVN, and a respective VPN tunnel is configured between each of the PPEs and the customer data center. Routing information pertaining to the set of resources is provided to the customer data center via at least one of the VPN tunnels, enabling routing of customer data to the set of resources within the provider network from the customer data center.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: November 7, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Upendra Bhalchandra Shevade, Gregory Rustin Rogers, Kevin Christopher Miller, Bashuman Deb, Michael Brooke Furr
  • Patent number: 9812415
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: November 7, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Matt E. Schwab, David J. Corisis, J. Michael Brooks
  • Publication number: 20170235449
    Abstract: This invention provides the end-to-end control, networking, and data management for the 1.) identification of event signings, 2.) generation of push invitations to such events, 3.) personalization of ebooks via reader-author collaboration to embed Personalized Multimedia Autographs (PMAs) into the ebook or other media, 4.) event line control allowing readers to browse the bookstore or mingle while waiting for collaboration with the author during these events, 5.) capability for the readers and author to discuss the event on social media after the readers have registered for the event enabling the author to tailor his/her comments at the vent to the readers' interests; 6.) synchronization and archival of the PMA among all of the reader's devices, 7.) integration of special services such as reserved seating as well as food and beverage that may make invitations to such events in the future very exclusive.
    Type: Application
    Filed: February 6, 2017
    Publication date: August 17, 2017
    Inventors: David Harris Walters, David Michael Brooks
  • Patent number: 9672503
    Abstract: Methods and apparatus for bandwidth metering in large-scale networks are disclosed. Metadata for a network transmission involving a virtualized resource at a host of a provider network, including endpoint address information and a traffic metric, is determined at a metering component. The metadata is aggregated at another metering component and provided to a traffic classification node. The traffic classification node generates a categorized usage record for the network transmission, based at least in part on network topology information associated with the provider network. The categorized usage record is used to determine a billing amount for the network transmission.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: June 6, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael Brooke Furr, Christopher Ian Hendrie, Kevin Christopher Miller, Ryan David Murphy, Sandeep Shantharaj