Patents by Inventor Michael Bryan Ball

Michael Bryan Ball has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of processing a wafer utilizing a processing slurry
    Patent number: 6354917
    Abstract: A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: March 12, 2002
    Assignee: Micron Technology, Inc.
    Inventor: Michael Bryan Ball
  • Wafer processing apparatus
    Patent number: 6234874
    Abstract: A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body.
    Type: Grant
    Filed: May 28, 1999
    Date of Patent: May 22, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Michael Bryan Ball
  • Method of processing a wafer utilizing a processing slurry
    Patent number: 6116988
    Abstract: A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body.
    Type: Grant
    Filed: May 28, 1999
    Date of Patent: September 12, 2000
    Assignee: Micron Technology Inc.
    Inventor: Michael Bryan Ball
  • Wafer processing apparatus and method of processing a wafer utilizing a processing slurry
    Patent number: 6074286
    Abstract: A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body.
    Type: Grant
    Filed: January 5, 1998
    Date of Patent: June 13, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Michael Bryan Ball