Abstract: Provided herein are systems and methods for manufacturing a cable. In some embodiments, a system for manufacturing a cable includes a joining mechanism configured to join the upper conducting foil and the lower conducting foil; and a linear actuator configured to control motion of the joining mechanism with respect to the upper conducting foil and the lower conducting foil. In some embodiments, a system for manufacturing a cable includes: an electrode configured to join the upper conducting foil and the lower conducting foil in a region between insulated conductors of the plurality of insulated conductors; and a plurality of rollers configured to position the upper conducting foil, the lower conducting foil, and the plurality of insulated conductors relative to the electrode.

Abstract: A dilution refrigerator is provided. The dilution refrigerator includes an outer vacuum chamber comprising at least one substantially planar surface and an opening in the at least one substantially planar surface configured to provide access to an interior of the outer vacuum chamber.

Abstract: A dilution refrigerator is provided. The dilution refrigerator includes a first thermal stage configured to be cooled to a first temperature, a second thermal stage configured to be cooled to a second temperature lower than the first temperature, and a vacuum chamber housing the first thermal stage and the second thermal stage. The dilution refrigerator also includes a first suspension system configured to suspend the first thermal stage from the vacuum chamber, and a second suspension system configured to suspend the second thermal stage from the vacuum chamber independently from the first thermal stage.

Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.

Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.

Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.

Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.

Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.

Abstract: A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.

Abstract: A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

Abstract: A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.

Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.

Abstract: A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

Abstract: A continuous liquid phase hydroprocessing process, apparatus and process control systems, where the need to circulate hydrogen gas through the catalyst is eliminated. By mixing and/or flashing the hydrogen and the oil to be treated in the presence of a solvent or diluent in which the hydrogen solubility is high relative to the oil feed, all of the hydrogen required in the hydroprocessing reactions may be available in solution. The oil/diluent/hydrogen solution can then be fed to a plug flow reactor packed with catalyst where the oil and hydrogen react. No additional hydrogen is required; therefore, the large trickle bed reactors can be replaced by much smaller tubular reactors. The amount of hydrogen added to the reactor can be used to control the liquid level in the reactor or the pressure in the reactor.

Abstract: A process where the need to circulate hydrogen through the catalyst is eliminated is provided. This is accomplished by mixing and/or flashing the hydrogen and the oil to be treated in the presence of a solvent or diluent in which the hydrogen solubility is “high” relative to the feed. The type and amount of diluent added, as well as the reactor conditions, can be set so that all of the hydrogen required in the hydroprocessing reactions may be available in solution. The oil/diluent/hydrogen solution can then be fed to a plug flow reactor packed with catalyst where the oil and hydrogen react. No additional hydrogen is required, therefore, hydrogen recirculation is avoided and trickle bed operation of the reactors is avoided. Therefore, the large trickle bed reactors can be replaced by much smaller tubular reactor.