Patents by Inventor Michael C. Andrews

Michael C. Andrews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160368322
    Abstract: A tire is provided having a body ply that is displaced from the conventional equilibrium curve along the shoulder and upper side wall region of the tire in a manner that provides more uniform inflation growth along the crown region so as to reduce differences in rigidity between the center and shoulders of the tire, reduce load sensitivity, and/or decrease the propensity for cracking. A method for designing or constructing such a tire is also provided.
    Type: Application
    Filed: February 27, 2014
    Publication date: December 22, 2016
    Inventors: Brian GANNON, William B. CLAYTON, Michael C. ANDREWS, Maxime ROLLAND, Daniel McEachern HICKS
  • Patent number: 8644979
    Abstract: A method for optimizing the location of heating elements within a mold for a rubber article. The position of one or more heating elements, e.g., curing pins or sipes, within the tread mold for a tire can be determined using a 3-D temperature profile so as to improve the efficiency of the curing process. For purposes of the optimization, the number of possible locations for such heating elements can be varied depending upon e.g., the computational time and accuracy desired.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: February 4, 2014
    Assignee: Michelin Recherche et Technique S.A.
    Inventors: Youneng Wang, Christopher S. Madden, Michael C. Andrews
  • Publication number: 20110098836
    Abstract: A method for optimizing the location of heating elements within a mold for a rubber article is provided. More particularly, a method is also provided for optimizing the position of one or more heating elements, e.g., curing pins or sipes, within the tread of a tire to improve the efficiency of the curing process.
    Type: Application
    Filed: June 30, 2008
    Publication date: April 28, 2011
    Inventors: Youneng Wang, Christopher S. Madden, Michael C. Andrews