Abstract: Systems and methods are provided for determining secondary address information. In one implementation, a method is provided that uses a data processing apparatus. According to the method, a code word is created for a business name and a building default extended delivery code. A data table is searched using the code word and secondary address information is revealed when a match is found between the code word and data stored in the data table.

Abstract: Systems and methods for providing an alternative delivery point code may comprise receiving delivery data corresponding to a delivery point. Furthermore, the systems and methods may include determining if the delivery data includes a secondary element. Moreover, the systems and methods may include creating the alternative delivery point code based upon the secondary element if the delivery data includes the secondary element. The secondary element may comprise a descriptor or a secondary number associated with the delivery point. If the delivery data does not include the secondary element, a normal delivery point code may be created.

Abstract: Systems and methods are provided for determining secondary address information. In one implementation, a method is provided that uses a data processing apparatus. According to the method, a code word is created for a business name and a building default extended delivery code. A data table is searched using the code word and secondary address information is revealed when a match is found between the code word and data stored in the data table.

Abstract: A method and system for providing address matching consistent with the invention includes comparing the address against a plurality of address records in a database, wherein the database comprises at least one or the following: a delivery point database (505) and an enhanced delivery point database (705). In addition, the method and system include providing output data indicating whether the address has been matched to at least one of the plurality of address records in the database.

Abstract: A method of forming a high thermal conductivity diamond film and its associated structures comprising selectively nucleating a region of a substrate, and forming a diamond film on the substrate such that the diamond film has large grains, which are at least about 20 microns in size. Thus, the larger grained diamond film has greatly improved thermal management capabilities and improves the efficiency and speed of a microelectronic device.

Abstract: A method of forming a high thermal conductivity diamond film and its associated structures comprising selectively nucleating a region of a substrate, and forming a diamond film on the substrate such that the diamond film has large grains, which are at least about 20 microns in size. Thus, the larger grained diamond film has greatly improved thermal management capabilities and improves the efficiency and speed of a microelectronic device.

Abstract: A method and system for providing address matching consistent with the invention includes comparing the address against a plurality of address records in a database, wherein the database comprises at least one or the following: a delivery point database (505) and an enhanced delivery point database (705). In addition, the method and system include providing output data indicating whether the address has been matched to at least one of the plurality of address records in the database.

Abstract: Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Abstract: A method of forming a high thermal conductivity diamond film and its associated structures comprising selectively nucleating a region of a substrate, and forming a diamond film on the substrate such that the diamond film has large grains, which are at least about 20 microns in size. Thus, the larger grained diamond film has greatly improved thermal management capabilities and improves the efficiency and speed of a microelectronic device.

Abstract: Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Abstract: A method and system for providing address matching. An address is compared against a plurality of address records in a database, wherein the database comprises at least one of the following: a delivery point database and an enhanced delivery point database. In addition, the method and system include providing an output data indicating whether the address has been matched to at least one of the plurality of address records in the database.

Abstract: Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Abstract: Apparatus and methods in accordance with the present invention provide self-contained, closed-loop microchannel/electrokinetic pump cooling systems that can be integrated into the microelectronic die and the integrated heat sink to provide microelectronic die cooling. Microchannel/electrokinetic pump cooling systems utilize active cooling technology to reduce thermal gradients and operating temperature of a microelectronic die. This system disclosed here will enhance heat dissipation and provide immediate cooling of localized hot spots within the microelectronic die. This will have the effect of reducing the microelectronic die temperature or spreading the heat internally within the microelectronic die depending on the layout of the microchannels.

Abstract: Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Abstract: Apparatus and methods in accordance with the present invention provide self-contained, closed-loop microchannel/electrokinetic pump cooling systems that can be integrated into the microelectronic die and the integrated heat sink to provide microelectronic die cooling. Microchannel/electrokinetic pump cooling systems utilize active cooling technology to reduce thermal gradients and operating temperature of a microelectronic die. This system disclosed here will enhance heat dissipation and provide immediate cooling of localized hot spots within the microelectronic die. This will have the effect of reducing the microelectronic die temperature or spreading the heat internally within the microelectronic die depending on the layout of the microchannels.

Abstract: A method of forming a high thermal conductivity diamond film and its associated structures comprising selectively nucleating a region of a substrate, and forming a diamond film on the substrate such that the diamond film has large grains, which are at least about 20 microns in size. Thus, the larger grained diamond film has greatly improved thermal management capabilities and improves the efficiency and speed of a microelectronic device.

Abstract: A method and system for providing, address matching consistent with the invention includes comparing the address against a plurality of address records in a database, wherein the database comprises at least one of the following: a delivery point database (505) and an enhanced delivery point database (705). In addition, the method and system include providing, output data indicating, whether the address has been matched to at least one of the plurality of address records in the database.