Patents by Inventor Michael C. Kelley

Michael C. Kelley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Minimally invasive implantable neurostimulation system
    Patent number: 11957893
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde, David A. Dinsmoor, Duane L. Bourget, Forrest C M Pape, Gabriela C. Molnar, Joel A. Anderson, Michael J. Ebert, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Timothy J. Denison, Todd V. Smith
  • Minimally invasive implantable neurostimulation system
    Patent number: 11957894
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Anthony M. Chasensky, Bernard Q. Li, Brad C. Tischendorf, Chris J. Paidosh, Christian S. Nielsen, Craig L. Schmidt, David A. Dinsmoor, Duane L. Bourget, Eric H. Bonde, Erik R. Scott, Forrest C M Pape, Gabriela C. Molnar, Gordon O. Munns, Joel A. Anderson, John E. Kast, Joseph J. Viavattine, Markus W. Reiterer, Michael J. Ebert, Phillip C. Falkner, Prabhakar A. Tamirisa, Randy S. Roles, Reginald D. Robinson, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Thomas P. Miltich, Timothy J. Denison, Todd V. Smith, Xuan K. Wei
  • SYSTEM AND METHODS FOR RISK PREDICTION AND ASSESSMENT
    Publication number: 20150051837
    Abstract: A system and methods for predicting and assessing risk before an event occurs. More particularly, the present invention predicts and assesses risk such as the occurrence of an earthquake prior to the event by collecting and analyzing changes in Total Electron Content (“TEC”) in the ionosphere.
    Type: Application
    Filed: April 4, 2013
    Publication date: February 19, 2015
    Inventors: Michael C. Kelley, Wesley E. Swartz
  • Through-board PCB edge connector, system and method
    Patent number: 6814583
    Abstract: A female edge connector is cut into a circuit board to reduce the connector size and therefore the distance the signal path is separated from the ground plane. Preferably, the female connector is a surface mount connector and is provided in two pieces. This allows the female connector to be attached to either side of the printed circuit board or can be connected to both sides if half of the connector is mounted on the opposite side of the board from the other. A male edge connector of a plug-in board can then be inserted through the aperture formed in the mother board to contact the female edge connector, providing very little distance between the ground planes of the plug-in board and the mother board. The distance between the two pieces of the female connector can be varied by changing the width of the aperture such that PC boards of various thicknesses can be accommodated.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: November 9, 2004
    Assignee: Silicon Image, Inc.
    Inventors: J. Pat Young, Michael C. Kelley, Joungho Kim