Abstract: A semiconductor device (10) having a reduced die support area (24) includes a semiconductor die (11) having a plurality of bond pads (17) which are electrically coupled to a plurality of leads (16) by wire bonds (15). The die is supported solely by two cantilevered tie bars (20). Use of cantilevered tie bars decreases the total plastic-metal interface area in a plastic encapsulated device, thereby lessening the probability of internal delamination and package cracking. The cantilevered tie bars also permit a variety of die sizes to be used with the same leadframe design. Optionally, a power supply bar may be used to connect the two tie bars to provide an electrical bus for the device.

Abstract: A lead-on-chip (LOC) device (44) has a comb-shaped (32) or a cut-out (38) tape as the means of attachment for the leads (14) to the die surface. The LOC tape has cut-outs between the leads to minimize the amount of tape between the leads. The cut-outs are provided by either making the tape comb-shaped so that it has teeth and gaps between each tooth or by having oblong-shaped cut-outs in the tape corresponding in location the gaps between the leads. By minimizing the tape to die interface between the leads, the chance of voids forming between the leads is eliminated.