Abstract: A housing for a multi-board electronic module is disclosed. The housing comprises a rear wall, side walls, a top wall and a bottom wall cooperating to define an enclosure having an open front. Brackets located in the enclosure permit mounting of the electronic circuit boards in a substantially vertical orientation. Vent openings in the top and the bottom walls cooperate with the vertically oriented electronic circuit boards to permit air heated by the electronic components located on the circuit boards to escape the housing through the top wall vent openings and for permitting ambient air to enter the bottom wall vent openings. The ambient air replaces the escaping air and cools the components located on the electronic circuit boards. The housing can be either wall mounted or mounted in a register rack assembly.