Patents by Inventor Michael C. Welsberg

Michael C. Welsberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure
    Patent number: 7574787
    Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: August 18, 2009
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Baomin Xu, Steven A. Buhler, Michael C. Welsberg, William S. Wong, Scott E. Solberg, Karl A. Littau, John S. Fitch, Scott A. Elrod
  • Methods to make piezoelectric ceramic thick film array and single elements and devices
    Publication number: 20090113685
    Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics. In another embodiment, a material for a thick film element is deposited onto a surface of a first substrate to form a thick film element structure having a thickness of between greater than 10 ?m to 100 ?m.
    Type: Application
    Filed: February 28, 2006
    Publication date: May 7, 2009
    Inventors: Baomin Xu, Steven A. Buhler, Michael C. Welsberg, William S. Wong, Scott E. Solberg, Karl A. Littau, John S. Fitch, Scott A. Elrod