Abstract: Process carriers include slots defined by teeth. The slots are each configured to receive a substrate, and each of the slots has slot angle in a range from 47° to 76°. The teeth can extend half or less of a height of the process carrier. The teeth can be configured to be spaced apart by at least a thickness of the disk or wafer to be received in the slots. The teeth can be configured such that when the substrate is seated in one of the plurality of slots, a center of the substrate is positioned towards a tooth end of the process carrier with respect to a height direction of the first side wall and the second side wall.

Abstract: Purge diffusers for use in systems for transporting substrates include: i) a purge diffuser core having an internal purge gas channel, one or more diffuser ports and an outer surface; ii) filter media secured to the outer surface of the purge diffuser core; and iii) a purge port connector for mounting the purge diffuser to a purge port of a substrate container for transporting substrates. The purge diffuser core may be a unitary article, may be formed by injection molding, and may include diverters internal to the internal purge gas channel.

Abstract: An article includes a substrate container for holding one or more substrates or reticles. The substrate container has a housing including one or more sidewalls, a closed end, an open end, and an interior space defined by the one or more side walls and the closed end. The container further has a door configured to close the open end of the housing. The door includes a door body having a seal coupling portion. The door body is formed of a door body polymer. The door further includes a seal member integrally formed with the seal coupling portion of the door body.

Abstract: A substrate container includes a shell defining an interior space and a purge flow distribution system. The shell includes a front opening, a bottom wall, and a rear wall. The purge flow distribution system receives a stream of purge gas and includes an inlet and a network of separate gas distributing devices configured to distribute the stream of purge gas into the interior space. A supply line is also included that is connected to the inlet and configured to divide the supply of purge gas to the network of separate gas distributing devices. A method of purging an open substrate container includes supplying a stream of purge gas to an inlet of a purge flow distribution system and dividing the purge gas to supply a network of separate gas distributing devices to distribute the stream of purge gas into the interior space.

Abstract: A semiconductor processing apparatus including: a substrate comprising a polymer material layer; and a conductive polymer coating layer that coats at least a portion of the polymer material layer of the substrate, wherein the conductive polymer coating layer comprises conjugated polymers, wherein the conductive polymer coating layer has a total extractable metals less than 400 ng/g, and wherein the conductive polymer coating layer is configured to discharge electrostatic buildup in the semiconductor processing apparatus when connected to a semiconductor processing system.

Abstract: Purge diffusers for use in systems for transporting substrates include: i) a purge diffuser core having an internal purge gas channel, one or more diffuser ports and an outer surface; ii) filter media secured to the outer surface of the purge diffuser core; and iii) a purge port connector for mounting the purge diffuser to a purge port of a substrate container for transporting substrates. The purge diffuser core may be a unitary article, may be formed by injection molding, and may include diverters internal to the internal purge gas channel.

Abstract: A substrate container includes a shell defining an interior space and a purge flow distribution system. The shell includes a front opening, a bottom wall, and a rear wall. The purge flow distribution system receives a stream of purge gas and includes an inlet and a network of separate gas distributing devices configured to distribute the stream of purge gas into the interior space. A supply line is also included that is connected to the inlet and configured to divide the supply of purge gas to the network of separate gas distributing devices. A method of purging an open substrate container includes supplying a stream of purge gas to an inlet of a purge flow distribution system and dividing the purge gas to supply a network of separate gas distributing devices to distribute the stream of purge gas into the interior space.

Abstract: Substrate containers include purge flow distribution systems. The purge flow distribution systems can divide one or more input flows of purge gas to a plurality of gas distribution surfaces of a network of gas distribution devices. Methods of controlling purge can include configuring the substrate containers to provide determined purge gas flow rates at each of the gas distribution surfaces. The configuration can be performed using flow controls of the purge flow distribution systems. The purge gas flow rates can be determined based on purge performance parameters. A controller can direct the operation of the purge flow distribution systems. The controller and the substrate container can be combined in a substrate container purging system.

Abstract: A process container includes flanges defining a plurality of slots. At least one of the flanges includes a tightener configured to contact a disc or wafer when the disc or wafer is inserted into one of the plurality of slots defined by said at least one of the plurality of flanges. The tightener projects outwards from said at least one of the plurality of flanges into said one of the plurality of slots. The tightener includes a tapered portion where a cross-sectional thickness of the at least one tightener increases along an insertion direction of the disc or wafer into said one of the plurality of slots. The tightener can include one continuous slope or curve. The tightener can include a chamfer. The tightener has a reduced contact area and a smooth transition as it extends from the flange, reducing rubbing and the corresponding particle shedding when discs or wafers are inserted into, removed from, or moving while stored within the process container.

Abstract: Purge diffusers for use in systems for transporting substrates include: i) a purge diffuser core having an internal purge gas channel, one or more diffuser ports and an outer surface; ii) filter media secured to the outer surface of the purge diffuser core; and iii) a purge port connector for mounting the purge diffuser to a purge port of a substrate container for transporting substrates. The purge diffuser core may be a unitary article, may be formed by injection molding, and may include diverters internal to the internal purge gas channel.

Abstract: Environmental control material holders can retain environmental control material within wafer carriers, allowing the environmental control material to protect wafers from moisture while also securing the environmental control material. The environmental control material holders may include a baseplate and tabs defining spaces to hold environmental control material, and can be configured to engage a handle of a wafer cassette. The environmental control material holders may retain one or more environmental control materials. Additionally, the environmental control material holders can be configured to also retain a humidity indicator.

Abstract: Optimizing purge flow parameters in a substrate container, includes streaming a purge working fluid into an interior of the substrate container, discharging the purge working fluid from the interior of the substrate container, and varying purge flow parameters of the purge working fluid for a predetermined period of time, detecting at least one environmental condition in the interior of the substrate container during the predetermined period of time, determining optimized purge flow parameters based on the varied purge flow parameters and the at least one detected environmental condition during the predetermined period of time, and adjusting the streaming and the discharging in accordance with the optimized purge flow parameters. The substrate container may include, for example, a front opening unified pod or a reticle pod.

Abstract: Environmental control material holders can retain environmental control material within wafer carriers, allowing the environmental control material to protect wafers from moisture while also securing the environmental control material. The environmental control material holders may include a baseplate and tabs defining spaces to hold environmental control material, and can be configured to engage a handle of a wafer cassette. The environmental control material holders may retain one or more environmental control materials. Additionally, the environmental control material holders can be configured to also retain a humidity indicator.

Abstract: Purge diffusers for use in systems for transporting substrates include: i) a purge diffuser core having an internal purge gas channel, one or more diffuser ports and an outer surface; ii) filter media secured to the outer surface of the purge diffuser core; and iii) a purge port connector for mounting the purge diffuser to a purge port of a substrate container for transporting substrates. The purge diffuser core may be a unitary article, may be formed by injection molding, and may include diverters internal to the internal purge gas channel.

Abstract: The invention relates to transport and shipping containers for wafers that are processed into semiconductor units. The wafer transport system provides wafer carriers that provide damage protection and particulate protection with minimal contamination of the wafers in the shipper. The invention includes a wafer cushion for cushioning semiconductor wafers that is made of a closed-cell polyethylene material with a surface resistivity of less than 5×107 ohms per square that has less than 1800 ng/g Cl?, 400 ng/g F?/Acetate, 270 ng/g NO3?, 350 ng/g SO42?, and 60 ng/g PO43?ions leachable under moderate conditions. The wafer cushion optimally has no detectable outgassing organics under stringent conditions. The static control properties are the result of carbon that is part of the structure of the material.

Abstract: A wafer container has an open front defined by a frame for receiving a door. The frame has slots on opposite sides. The door utilizes two latching linkages that extend, lift, lower and retract two latching portions from the edge portion of each opposite side of the door and into and out of latch receptacles on the frame. Each latching mechanism utilizes a sliding plate with a handle connected thereto and exposed on the front of the door. The sliding plate has a pair of lifting linkages cooperating with a pair of latching linkages. Moving the handles outwardly extends the latching portions into the latching receptacles, then pulls the door inwardly to seal the door to the container portion. The sliding plate includes a rack portion engaged with a pinion accessible from the front of the door by a latch key whereby the mechanism can be operated robotically.

Abstract: A wafer shipper for stacked wafers provides significantly improved resistance to shock and impact as well as flexibility and tolerance in wafer capacities and guidance in optimal amount of packing material. The shipper has a base and a top cover both of which have a nominal wall that primarily forms all of the features of the respective components. The base has four sides, four corners, and arcuate wall segments defining a wafer stack pocket. The sides are formed of a downwardly extending nominal wall portion and an upwardly extending lip. Both adjoin a nominal wall defining a planar surface that extends around the base and forms a seat for the top cover. The planar surface adjoins the arcuate wall segments and also adjoins the floor of the wafer stack pocket that is also part of the nominal wall.

Abstract: The invention relates to transport and shipping containers for wafers that are processed into semiconductor units. The wafer transport system provides wafer carriers that provide damage protection and particulate protection with minimal contamination of the wafers in the shipper. The invention includes a wafer cushion for cushioning semiconductor wafers that is made of a closed-cell polyethylene material with a surface resistivity of less than 5×107 ohms per square that has less than 1800 ng/g Cl−, 400 ng/g F−/Acetate, 270 ng/g NO3−, 350 ng/g SO42−, and 60 ng/g PO43−ions leachable under moderate conditions. The wafer cushion optimally has no detectable outgassing organics under stringent conditions. The static control properties are the result of carbon that is part of the structure of the material.

Abstract: A low tolerance build-up wafer carrier and method for assembling the same for supporting semiconductor wafer disks and for interfacing with processing equipment. Press-fit fasteners are used to assemble composite carriers and attach equipment interface portions to the carrier. Each press-fit fastener comprising a first fastener portion integral with a first element and a second fastener portion integral with a second element. The first and second fastener portions interferingly engaging each other when pressed together thereby connecting first and second elements without significant tolerance build-up. A further embodiment of the invention is to provide a wafer carrier having interface contact portions positioned to accept carrier contact portions, from processing equipment, through a guide plate or kinematic coupling. The interface contact portions acting to align the carrier and prevent tolerance build-up due to the flexing of the guide plate.

Abstract: A low tolerance build-up wafer carrier and method for assembling the same for supporting semiconductor wafer disks and for interfacing with processing equipment. Press-fit fasteners are used to assemble composite carriers and attach equipment interface portions to the carrier. Each press-fit fastener comprising a first fastener portion integral with a first element and a second fastener portion integral with a second element. The first and second fastener portions interferingly engaging each other when pressed together thereby connecting first and second elements without significant tolerance build-up. A further embodiment of the invention is to provide a wafer carrier having interface contact portions positioned to accept carrier contact portions, from processing equipment, through a guide plate or kinematic coupling. The interface contact portions acting to align the carrier and prevent tolerance build-up due to the flexing of the guide plate.