Abstract: Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.

Abstract: Systems and methods are disclosed for automated generation of integrated circuit designs and associated data. These allow the design of processors and SoCs by a single, non-expert who understands high-level requirements; allow the en masse exploration of the design-space through the generation processors across the design-space via simulation, or emulation; allow the easy integration of IP cores from multiple third parties into an SoC; allow for delivery of a multi-tenant service for producing processors and SoCs that are customized while also being pre-verified and delivered with a complete set of developer tools, documentation and related outputs. Some embodiments, provide direct delivery, or delivery into a cloud hosting environment, of finished integrated circuits embodying the processors and SoCs.

Abstract: An orthogonal frequency division multiplexing (OFDM) communication system includes a first interface having a first cable coupler to couple to a first end of a coaxial cable, and a first plurality of signal pathways coupled to the first cable coupler. Each signal pathway of the first plurality includes a physical (PHY) layer component and a radio frequency (RF) front end coupled to the PHY layer component. The system further includes a second interface having a second cable coupler to couple to a second end of a coaxial cable, and a second plurality of signal pathways coupled to the second cable coupler. Each signal pathway of the second plurality corresponds to a signal pathway of the first plurality and includes a PHY layer component and an RF front end coupled to the PHY layer component.

Abstract: An orthogonal frequency division multiplexing (OFDM) communication system includes a first interface having a first cable coupler to couple to a first end of a coaxial cable, and a first plurality of signal pathways coupled to the first cable coupler. Each signal pathway of the first plurality includes a physical (PHY) layer component and a radio frequency (RF) front end coupled to the PHY layer component. The system further includes a second interface having a second cable coupler to couple to a second end of a coaxial cable, and a second plurality of signal pathways coupled to the second cable coupler. Each signal pathway of the second plurality corresponds to a signal pathway of the first plurality and includes a PHY layer component and an RF front end coupled to the PHY layer component.

Abstract: An oscillator includes a compensated current source that adjusts an output current based on process, supply voltage, and temperature (“PVT”) variations of an integrated circuit device. The oscillator generates an output signal having a frequency based, in part, on the output current of the compensated current source. Accordingly, the output signal has a relatively low sensitivity to PVT variations.

Abstract: An oscillator includes a compensated current source that adjusts an output current based on process, supply voltage, and temperature (“PVT”) variations of an integrated circuit device. The oscillator generates an output signal having a frequency based, in part, on the output current of the compensated current source. Accordingly, the output signal has a relatively low sensitivity to PVT variations.

Abstract: A low power distributed transmitter includes a signal generator, signal partitioning module, signal processing module, a plurality of amplifiers, and a transmitting module. The signal generator is operably coupled to generate a signal to represent base-band data in accordance with a particular transmission protocol. The signal partitioning module is operably coupled to partition the signal into a plurality of signal partitions based on a peak-to-average ratio of the signal. The signal processing module processes the plurality of signal partitions to in accordance with the particular transmission protocol to produce processed signals. Each of the amplifiers amplifies a corresponding one of the processed signal partitions to produce amplified signal partitioned. The transmitting module transmits, via an antenna or a plurality of antennas, the amplified signal partitions as a composite amplified signal.

Abstract: A method of manufacturing a high frequency integrated circuit begins by positioning a die within a package, wherein the die includes a circuit that processes a high frequency signal and at least one bond pad operably coupled to the circuit, and wherein the package includes a plurality of bond posts, wherein at least one of the plurality of bond posts is allocated to the at least one bond pad. The method continues by bonding a first plate of a capacitor to the at least one bond pad. The method continues by bonding a second plate of the capacitor to the at one of the plurality of bond posts.

Abstract: A high frequency integrated circuit includes a die, a package and capacitive bond. The die includes a circuit that processes a high frequency signal and also includes at least one bonding pad coupled to the circuit. The package includes a plurality of bonding posts, at least one of the bonding posts is allocated to the at least one bond pad of the die. A bonding capacitor couples the at least one bond pad on the die to the at least one bond post of the package.

Abstract: A low power distributed transmitter includes a signal generator, signal partitioning module, signal processing module, a plurality of amplifiers, and a transmitting module. The signal generator is operably coupled to generate a signal to represent base-band data in accordance with a particular transmission protocol. The signal partitioning module is operably coupled to partition the signal into a plurality of signal partitions based on a peak-to-average ratio of the signal. The signal processing module processes the plurality of signal partitions to in accordance with the particular transmission protocol to produce processed signals. Each of the amplifiers amplifies a corresponding one of the processed signal partitions to produce amplified signal partitioned. The transmitting module transmits, via an antenna or a plurality of antennas, the amplified signal partitions as a composite amplified signal.

Abstract: A low power radio transmitter includes an intermediate frequency stage, signal-to-pulse conversion module, and a power amplifier. The intermediate frequency stage up-converts the frequency of a base-band digital signal into an N-bit signal at the intermediate frequency. The signal-to-pulse conversion module converts the N-bit signal at the intermediate frequency into a pulse signal of M-bits at the radio frequency. As such, the signal-to-pulse conversion module is taking an N-bit signal (e.g., an 8-bit digital signal) and converting it into an M-bit pulse signal (e.g., a 1-bit pulse stream). Accordingly, the M-bit signal at the radio frequency is essentially a square-wave, which has a peak to average ratio of zero, is subsequently amplified by the power amplifier.

Abstract: A method of manufacturing a high frequency integrated circuit begins by positioning a die within a package, wherein the die includes a circuit that processes a high frequency signal and at least one bond pad operably coupled to the circuit, and wherein the package includes a plurality of bond posts, wherein at least one of the plurality of bond posts is allocated to the at least one bond pad. The method continues by bonding a first plate of a capacitor to the at least one bond pad. The method continues by bonding a second plate of the capacitor to the at one of the plurality of bond posts.

Abstract: Generation of an output voltage (28) greater than that of a reference voltage (20) is accomplished using a self starting low voltage charge pump (10). A start-up clock circuit (12) comprising a ring oscillator (40) is used to generate a ting oscillator clock signal (63) which can be used allow the charge pump (10) to begin operation before an external clock signal (44) is available.