Patents by Inventor Michael Chao

Michael Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7853425
    Abstract: Provided is a method and system for testing a DUT. The system includes a plurality of testing devices for interacting with the DUT and conducting a plurality of different tests on the DUT, and a computer-readable memory for storing computer-executable instructions defining the plurality of tests to be conducted by the testing device on the DUT. A scheduler component designates at least a first test and a second test from the plurality of tests to be conducted on the DUT in parallel, wherein said designating is based at least in part on content of the computer-executable instructions defining the first test and the second test. And a controller initiates the first test and the second test to be conducted in parallel and initiating at least a third test sequentially relative to at least one of the first and second tests.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: December 14, 2010
    Assignee: Keithley Instruments, Inc.
    Inventors: Jerold A. Williamson, Michael Chao, Joseph N. Furio, Miao Lei
  • Patent number: 6633492
    Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: October 14, 2003
    Assignee: Methode Electronics, Inc.
    Inventors: Ryan Kimura, James Farquhar, Jeffrey Allen, Michael Chao, Stephen Hatch, Scott Herbert, Brandt Weibezhan, Iggoni Fajardo
  • Publication number: 20020124400
    Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
    Type: Application
    Filed: March 13, 2001
    Publication date: September 12, 2002
    Applicant: Methode Electronics, Inc.
    Inventors: Ryan Kimura, James Farquhar, Jeffrey Allen, Michael Chao, Stephen Hatch, Scott Herbert, Brandt Weibezhan, Iggoni Fajardo
  • Publication number: 20010019475
    Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
    Type: Application
    Filed: March 13, 2001
    Publication date: September 6, 2001
    Applicant: Methode Electronics, Inc.
    Inventors: Ryan Kimura, James Farquhar, Jeffrey Allen, Michael Chao, Stephen Hatch, Scott Herbert, Brandt Weibezhan, Iggon Fajardo
  • Publication number: 20010017215
    Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
    Type: Application
    Filed: March 13, 2001
    Publication date: August 30, 2001
    Applicant: Methode Electronics, Inc.
    Inventors: Ryan Kimura, James Farquhar, Jeffrey Allen, Michael Chao, Stephen Hatch, Scott Herbert, Brandt Weibezhan, Iggoni Fajardo
  • Patent number: 6269537
    Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: August 7, 2001
    Assignee: Methode Electronics, Inc.
    Inventors: Ryan Kimura, James Farquhar, Jeffrey Allen, Michael Chao, Stephen Hatch, Scott Herbert, Brandt Weibezhan, Iggoni Fajardo