Patents by Inventor Michael Cheong

Michael Cheong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131586
    Abstract: Alloyed metals, and techniques for creating parts from alloyed metals, are disclosed. An apparatus in accordance with an aspect of the present disclosure comprises an alloy. An additive manufacturing alloy in accordance with the present disclosure may comprise magnesium (Mg) that is between 2.0 and 5.3% by weight, manganese (Mn) that is between 0.01 and 4.0% by weight, silicon (Si) that is between 0.1 and 1.5% by weight, zirconium (Zr) that is between 0.01 and 2.0% by weight, and aluminum (Al). In some cases, the alloy such as described in the previous sentence might not include Mg.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 25, 2024
    Inventors: Mu LI, Keith Mathew MERTAN, Chan Cheong PUN, Michael Thomas KENWORTHY
  • Publication number: 20040157028
    Abstract: Adhesive tape composed of a sheet based on plasticized polyvinyl chloride and an adhesive dispersion based on styrene-acrylic acid derivative copolymers, comprising plasticizers which have migrated from the sheet into the adhesive.
    Type: Application
    Filed: December 11, 2003
    Publication date: August 12, 2004
    Applicant: tesa Aktiengesellschaft
    Inventors: Dieter Wenninger, Petrus Sentosa, Michael Cheong
  • Patent number: 6439931
    Abstract: A method and structure of an electrical connector is provided for tuning the impedance of the terminals in the connector. The connector includes a dielectric housing having a plurality of terminal-receiving passages. A plurality of terminals are shaped from sheet metal material, with each terminal having a contact portion at one end and a terminating portion at an opposite end. The contact portion has a contact area which engages a mating terminal of a complementary mating connecting device. The contact portion, except for the contact thereof, or the tail portion, is selectively trimmed to a given size to vary the plate area of the contact portion or the tail portion to adjust the impedance of the terminal. This may be done by removing sections of the contact portion from the contact edges or by forming holes in the contact portions. Alternatively, to adjust impedance, a drive shoulder of the terminal may be located at a position to lengthen or shorten the contact portion or tail portion.
    Type: Grant
    Filed: May 13, 1998
    Date of Patent: August 27, 2002
    Assignee: Molex Incorporated
    Inventors: Toshihiro Niitsu, Stephen A. Sampson, Daniel Dawiedczyk, David L. Brunker, Augusto Panella, Michael Cheong
  • Publication number: 20020022407
    Abstract: A method and structure of an electrical connector is provided for tuning the impedance of the terminals in the connector. The connector includes a dielectric housing having a plurality of terminal-receiving passages. A plurality of terminals are shaped from sheet metal material, with each terminal having a contact portion at one end and a terminating portion at an opposite end. The contact portion has a contact area which engages a mating terminal of a complementary mating connecting device. The contact portion, except for the contact thereof, or the tail portion, is selectively trimmed to a given size to vary the plate area of the contact portion or the tail portion to adjust the impedance of the terminal.
    Type: Application
    Filed: May 13, 1998
    Publication date: February 21, 2002
    Inventors: TOSHIHIRO NIITSU, STEPHEN A. SAMPSON, DANIEL DAWIEDCZYK, DAVID L. BRUNKER, AUGUSTO PANELLA, MICHAEL CHEONG