Abstract: An adapter for coupling a liquid cooling loop subassembly of a computing system to a device rack manifold includes a main body, a first connector disposed on the main body, a second connector disposed on the main body, and a flow control device disposed between the first and second connectors. The first connector couples the adapter to a coupling of the liquid cooling loop subassembly. The second connector couples the adapter to the device rack manifold. The flow control device may be configured to regulate a flow rate of liquid coolant through the liquid cooling loop subassembly. The adapter may be further incorporated into a rack assembly or multi-rack assembly to achieve thermal management of multiple computing systems with cooling loop subassemblies.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.

Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.

Abstract: A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

Abstract: A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.

Abstract: A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.