Patents by Inventor Michael Chy Chao

Michael Chy Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic housing, assemblies therefor and methods of making same
    Patent number: 8406001
    Abstract: An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: March 26, 2013
    Assignee: DualSonic, Inc.
    Inventor: Michael Chy Chao
  • ELECTRONIC HOUSING, ASSEMBLIES THEREFOR AND METHODS OF MAKING SAME
    Publication number: 20100220453
    Abstract: An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.
    Type: Application
    Filed: February 25, 2010
    Publication date: September 2, 2010
    Applicant: DUALSONIC, LLC
    Inventor: Michael Chy Chao