Patents by Inventor Michael Chye Huat Cheng

Michael Chye Huat Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8003529
    Abstract: A method of forming an integrated circuit is disclosed. The method includes providing a substrate and forming on the substrate a shield structure comprising a shield member and a ground strap. The shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: August 23, 2011
    Assignee: Globalfoundries Singapore Pte. Ltd.
    Inventors: Suh Fei Lim, Kok Wai Chew, Sanford Shao-Fu Chu, Michael Chye Huat Cheng
  • Publication number: 20100120244
    Abstract: A method of forming an integrated circuit is disclosed. The method includes providing a substrate and forming on the substrate a shield structure comprising a shield member and a ground strap. The shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.
    Type: Application
    Filed: January 25, 2010
    Publication date: May 13, 2010
    Applicant: CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
    Inventors: Suh Fei LIM, Kok Wai CHEW, Sanford Shao-Fu CHU, Michael Chye Huat CHENG
  • Patent number: 7652355
    Abstract: Embodiments of the invention provide an integrated circuit structure comprising: a substrate; a shield structure comprising a shield member and a ground strap formed on the substrate, wherein the shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: January 26, 2010
    Assignee: Chartered Semiconductor Manufacturing, Ltd.
    Inventors: Suh Fei Lim, Kok Wai Chew, Sanford Shao-Fu Chu, Michael Chye Huat Cheng