Patents by Inventor Michael Clifford Freda

Michael Clifford Freda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus, system, and method for mitigating the swiss cheese effect in high-current circuit boards
    Patent number: 11412610
    Abstract: A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: August 9, 2022
    Assignee: Juniper Networks, Inc
    Inventors: Boris Reynov, David K. Owen, Michael Clifford Freda, Steve M. Wilkinson, Jing Zhang
  • APPARATUS, SYSTEM, AND METHOD FOR MITIGATING THE SWISS CHEESE EFFECT IN HIGH-CURRENT CIRCUIT BOARDS
    Publication number: 20220141952
    Abstract: A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.
    Type: Application
    Filed: November 4, 2020
    Publication date: May 5, 2022
    Inventors: Boris Reynov, David K. Owen, Michael Clifford Freda, Steve M. Wilkinson, Jing Zhang
  • Multi-diameter unplugged component hole(s) on a printed circuit board (PCB)
    Patent number: 8923007
    Abstract: In at least one embodiment, a circuit board assembly that includes a printed circuit board is provided. The printed circuit board includes a top surface and a bottom surface for supporting at least one through-hole electrical component. The printed circuit board defines at least one component hole extending from the top surface to the bottom surface for receiving the at least one through-hole electrical component. The at least one component hole includes a first section having a first diameter and a second section having a second diameter. The first diameter is different from the second diameter. Each of the first and the second sections are configured to receive solder paste for forming a solder joint with the at least one through-hole electrical component.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: December 30, 2014
    Assignee: Oracle America, Inc.
    Inventors: Michael Francis Sweeney, Jorge Eduardo Martinez-Vargas, Jr., Michael Clifford Freda
  • Bond strength and interconnection in a via
    Patent number: 8431831
    Abstract: A via is provided on a printed circuit board with at least one additional depression encompassing the via, such that the via passes through a portion of the depression. Solder can pool in the depression, allowing for a stronger mechanical bond and eliminating many issues with respect to a lack of coplanarity between a lead and the printed circuit board. The depression can be provided with plugged and unplugged vias, and improves the mountings associated with both.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: April 30, 2013
    Assignee: Oracle America, Inc.
    Inventors: Michael Francis Sweeney, Jorge Eduardo Martinez-Vargas, Jr., Michael Clifford Freda
  • BOND STRENGTH AND INTERCONNECTION IN A VIA
    Publication number: 20100084178
    Abstract: A via is provided on a printed circuit board with at least one additional depression encompassing the via, such that the via passes through a portion of the depression. Solder can pool in the depression, allowing for a stronger mechanical bond and eliminating many issues with respect to a lack of coplanarity between a lead and the printed circuit board. The depression can be provided with plugged and unplugged vias, and improves the mountings associated with both.
    Type: Application
    Filed: October 8, 2008
    Publication date: April 8, 2010
    Applicant: SUN MICROSYSTEMS, INC.
    Inventors: Michael Francis Sweeney, Jorge Eduardo Martinez-Vargas, JR., Michael Clifford Freda
  • MULTI-DIAMETER UNPLUGGED COMPONENT HOLE(S) ON A PRINTED CIRCUIT BOARD (PCB)
    Publication number: 20100085717
    Abstract: In at least one embodiment, a circuit board assembly that includes a printed circuit board is provided. The printed circuit board includes a top surface and a bottom surface for supporting at least one through-hole electrical component. The printed circuit board defines at least one component hole extending from the top surface to the bottom surface for receiving the at least one through-hole electrical component. The at least one component hole includes a first section having a first diameter and a second section having a second diameter. The first diameter is different from the second diameter. Each of the first and the second sections are configured to receive solder paste for forming a solder joint with the at least one through-hole electrical component.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 8, 2010
    Applicant: SUN MICROSYSTEMS, INC.
    Inventors: Michael Francis Sweeney, Jorge Eduardo Martinez-Vargas, JR., Michael Clifford Freda