Patents by Inventor Michael Cline Murray

Michael Cline Murray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220042641
    Abstract: Provided are thermally insulating components that include sealed joints between the walls that define an insulating space therebetween. Also provided are related methods of forming and using the disclosed components. Additionally provided are thermally insulating components that include a positive thermal coefficient material.
    Type: Application
    Filed: November 27, 2019
    Publication date: February 10, 2022
    Inventors: Shriram RADHAKRISHNAN, David H. REID, Jr., Aarne H. REID, Peter ROACH, Michael Cline MURRAY
  • Publication number: 20210212175
    Abstract: Provided are thermally insulated modules that comprise a first shell and a first component having a first sealed evacuated insulating space therebetween and a current carrier configured to give rise to inductive heating. Also provided are methods of utilizing the disclosed thermally insulated modules in a variety of applications, including additive manufacturing and other applications.
    Type: Application
    Filed: April 16, 2019
    Publication date: July 8, 2021
    Inventors: David H. REID, Jr., Aarne H. REID, Shriram RADHAKRISHNAN, Michael Cline MURRAY, Peter ROACH
  • Publication number: 20210126306
    Abstract: The present disclosure provides insulated assemblies for electronics packaging, the assemblies in some embodiments including an electrical connection extending through a tube that extends through an insulating vacuum space.
    Type: Application
    Filed: January 4, 2021
    Publication date: April 29, 2021
    Inventors: Aarne H Reid, Michael Cline Murray
  • Publication number: 20210062957
    Abstract: Provided are thermally insulating components that include sealed joints between the walls that define an insulating space therebetween. Also provided are related methods of forming and using the disclosed components.
    Type: Application
    Filed: April 17, 2019
    Publication date: March 4, 2021
    Inventors: Shriram RADHAKRISHNAN, David H. REID, Jr., Aarne H. REID, Peter ROACH, William THOMAS, George LEDOUX, Michael Cline MURRAY
  • Patent number: 10923691
    Abstract: The present disclosure provides insulated assemblies for electronics packaging, the assemblies in some embodiments including an electrical connection extending through a tube that extends through an insulating vacuum space.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: February 16, 2021
    Assignee: Concept Group, LLC
    Inventors: Aarne H Reid, Michael Cline Murray
  • Publication number: 20200106059
    Abstract: The present disclosure provides insulated assemblies for electronics packaging, the assemblies in some embodiments including an electrical connection extending through a tube that extends through an insulating vacuum space.
    Type: Application
    Filed: December 2, 2019
    Publication date: April 2, 2020
    Inventors: Aarne H. Reid, Michael Cline Murray
  • Patent number: 10497908
    Abstract: The present disclosure provides insulated assemblies for electronics packaging, the assemblies in some embodiments including an electrical connection extending through a tube that extends through an insulating vacuum space.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: December 3, 2019
    Assignee: Concept Group, LLC
    Inventors: Aarne H Reid, Michael Cline Murray