Patents by Inventor Michael Cochrane

Michael Cochrane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240140991
    Abstract: A compound of formula (I) or formula (II) including tautomeric or stereochemically isomeric forms thereof, wherein: R1 represents C1-20 alkyl, C2-20 alkenyl, C6-20 aryl, or C4-20 heterocyclyl, each optionally substituted with one or more Y groups, R2a to R2l each independently represents H, C1-10 alkyl, C2-10 alkenyl, C6-12 aryl, or C4-12 heterocyclyl, each optionally substituted with one or more Y groups, R3 represents H, C1-10 alkyl, C2-10 alkenyl, C6-12 aryl, or C4-12 heterocyclyl, each optionally substituted with one or more Y groups, X represents NH, S or O, each Y independently represents cyano, halogen, N3, —C(O)RZ, —C(0)0Rz, —0C(0)Rz, —C(0)NHZ, —NHC(O)Rz, —NHC(0)NHRZ, —NHC(NH)NHRZ, —NCH(0)0Rz, -0C(0)NHRz, -0S(0)2RZ, —S(0)2NHRZ, —NHS(0)2RZ, —SRZ, —NRZZ or —ORz and each Rz independently represents H, C1-10 alkyl, C2-10 alkenyl, C6-10 aryl, or C4-10 heterocyclyl; or an N-oxide thereof or a pharmaceutically acceptable salt thereof or a pharmaceutically acceptable solvate thereof; and wherein formula (I) e
    Type: Application
    Filed: November 30, 2021
    Publication date: May 2, 2024
    Inventors: Stephen COCHRANE, Ross BALLANTINE, Nathaniel MARTIN, Karol AL AYED, Michael HOEKSTRA, Sofia Denise Zamarbide LOSADA
  • Patent number: 6333860
    Abstract: A communications card includes a housing formed by a top cover and a lower cover panel. The top cover is constructed from a generally non-conductive material and the lower cover panel is constructed from a conductive material. A substrate is disposed within the housing and a conductive panel is positioned between the substrate and the top cover. The conductive panel overlies at least a portion of the substrate, and the conductive panel and lower cover panel are electrically connected to ground when the communications card is inserted into a host device in order to decrease the electromagnetic radiation emitted by the communications card. Preferably, the communications card conforms to the standards established for a PCMCIA Type III card. Additionally, the communications card may include a modular jack with a main body portion having a top surface, a bottom outer surface and a front surface.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: December 25, 2001
    Assignee: 3Com Corporation
    Inventors: David Oliphant, Brent Madsen, Michael Cochrane