Abstract: An exit device comprises an inner door handle adapted to be mounted to a door for movement relative to the door from a first position to a second position. A pair of brackets are adapted to be operatively connected between the respective ends of a horizontal portion and a vertical portion of the door handle. Each bracket comprises a first bracket member secured to the door handle, a second bracket member adapted to be secured to the door, and a pin for joining the first bracket member and the second bracket member for rotation about an axis through the pin. The first bracket member and the second bracket member pivot relative to one another when the door handle moves between the first position and the second position.

Abstract: A secure evidence sharing engine may facilitate and/or aid in the sharing of evidence documentation between providers and recipients of such information. In some examples, the engine may receive, from a client device, some identification information associated with a user. Additionally, the user, requesting or purchasing evidence can identify further parties to notify. At a later date, evidentiary documentation may be received regarding an item associated with the user. The secure evidence sharing engine may notify the user and identified parties that the evidentiary documentation is available for access. The interested parties may then access the evidentiary documentation after agreeing to terms and conditions and possibly paying a fee. Upon receipt of new evidence after an initial notification, the user and identified parties may receive notification of the new evidence and may choose to access the new evidence in a similar manner.

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

Abstract: A method for lining tubular includes positioning an expandable liner in a wellbore at a depth of one or more perforations using a downhole depth locator tool. The expandable liner is expanded in the wellbore to line the one or more perforations.

Abstract: A video content distribution and management system is provided that comprises an event content recorder recording video content associated with an event as an event recording. A workstation stores and edits the event recording to form a composite event review file that is passed to a system manager over a restricted access network. The workstation is located remote from a system manager. The system manager automatically routes the composite event review file to the workstation which enables a user to designate a video segment from the composite event review file. The workstation forms a video clip from the video segment and enables the user to add annotation information to the video clip to form an annotated video clip. The workstation conveys the annotated video clip to the system manager for redistribution.

Abstract: Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

Abstract: Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

Abstract: A release tool includes a first subassembly and a second subassembly. A connector is operable to selectively couple the first subassembly to the second subassembly. A release guard is operable to selectively inhibit release of the connector.

Abstract: Certain methods of the invention permit spacerless manufacture of stacked microelectronic devices by mechanically supporting a second microelectronic component with a wire coating. This wire coating may be sufficiently adhesive to also mechanically bond the second microelectronic component to a first microelectronic component. Other embodiments of the invention provide spacerless stacked microelectronic devices wherein a second microelectronic component is mechanically supported by a wire coating.

Abstract: Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

Abstract: A method for balancing layer-caused compressive or tensile stress in a semiconductor die, die wafer or similar substrate uses a stress-balancing layer (SBL) attached to the opposite side from the stress-causing layer before the die or wafer is significantly warped are provided. The SBL may also serve as, or support, an adhesive layer for die attach and be of a markable material for an enhanced marking method.

Abstract: The present invention relates generally to lateral wellbore operations, and more particularly, to downhole tools that include a logging tool for locating a lateral wellbore and associated methods. In some embodiments, the present invention discloses a method for use in lateral wellbore operations that includes entering a lateral wellbore from a primary wellbore with a tool comprising a logging tool, and verifying entry into the lateral wellbore using the logging tool. In yet other embodiments, the present invention discloses methods of locating lateral wellbores from a primary wellbore, and downhole tools that comprise logging tools, such as casing collar locators, radiation detection logging tools, or combinations thereof.

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

Abstract: The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

Abstract: The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

Abstract: The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

Abstract: A tubing connector comprising a rigid member having a first end and a second end; a crimping groove disposed about the rigid member; and a sleeve fixably attached to the rigid member and covering the crimping groove. A method for connecting a tubing section to a rigid member, the method comprising fixably attaching a sleeve over one end of the rigid member to cover a crimping groove disposed on the rigid member, disposing the tubing section over the sleeve, and plastically deforming the tubing section and sleeve to form a plurality of dimples that project into the crimping groove of the rigid member.