Patents by Inventor Michael Corfield

Michael Corfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible power assembly
    Patent number: 6362964
    Abstract: A flexible power assembly (FPA) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is mounted directly on a heatsink, which supports a circuit board that is mounted above and spaced from the top side of the IMS. There are provided devices that are mounted on the circuit board which are electrically connected to the power semiconductor devices. There may be a cavity in the circuit board allowing the top of the IMS to be exposed, and optionally providing access for bonding wires to the top of the circuit. Bonding pads may be provided on the circuit board for electrical connection with the bonding wires. A cover may be optionally provided to enclose a space over the cavity. Potting compound may be contained in the space created by the cavity.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: March 26, 2002
    Assignee: International Rectifier Corp.
    Inventors: Ajit Dubhashi, Stephen Nicholas Siu, Heny W. Lin, Bertrand P. Vaysse, Michael A. Corfield
  • Wiring distribution hub for a concentrating photovoltaic system module
    Patent number: D657306
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: April 10, 2012
    Inventors: Richard J. Russell, Michael Corfield, Brian W. Lees, Michael F. Turk, Alan Frederik Golightly
  • Sealing ring for a concentrating photovoltaic system module
    Patent number: D701827
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: April 1, 2014
    Assignee: Suncore Photovoltaics, Inc.
    Inventors: Michael F. Turk, Robert J. Villegas, Richard J. Russell, Michael Corfield, Brian Lees