Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A disinfection apparatus, typically an autonomous or semi-autonomous robot which has a germicidal light source, a controller for controlling emission of germicidal light from the germicidal light source and a moveable support to which the germicidal light source is attached which is moveable across a surface. The apparatus may also have a detector which detects the presence of an object in the vicinity of the apparatus wherein the controller controls the direction of germicidal light from the light source in response to the detection of one or more said object.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method of manufacturing a nanoelectromechanical resonator allows for uniform tuning of a resonant frequency. The nanoelectromechanical resonator can be mass produced and used to sense the presence of a selected gas.

Abstract: A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Abstract: A method of manufacturing a nanoelectromechanical resonator allows for uniform tuning of a resonant frequency. The nanoelectromechanical resonator can be mass produced and used to sense the presence of a selected gas.

Abstract: An example metrology device can include a first stage including a microelectromechanical (MEMS) device having a probe, and a second stage configured to hold a sample. The metrology device can also include a kinematic coupler for constraining the first stage in a fixed position relative to the second stage. The probe of the MEMS device can be aligned with a portion of the sample when the first stage is constrained in the fixed position relative to the second stage.

Abstract: An example passive wafer alignment device can include a stage for holding a wafer, a plurality of pins arranged on the stage, the pins being arranged to contact respective portions of the wafer, and a preload device arranged on the stage. The preload device can be configured to apply a preload force to the wafer. In addition, two of the pins can be arranged to contact respective portions of a flat edge of the wafer, and a third pin and the preload device can be arranged to contact respective portions of a curved edge of the wafer. The third pin and the preload device can be arranged at respective locations on the stage to optimally constrain the wafer to the stage.

Abstract: An example metrology device can include a first stage including a microelectromechanical (MEMS) device having a probe, and a second stage configured to hold a sample. The metrology device can also include a kinematic coupler for constraining the first stage in a fixed position relative to the second stage. The probe of the MEMS device can be aligned with a portion of the sample when the first stage is constrained in the fixed position relative to the second stage.

Abstract: An example metrology device can include a plurality microelectromechanical (MEMS) devices, where each of the MEMS devices has a probe, and a plurality of flexure elements configured to independently displace the MEMS devices. Each of the flexure elements can be coupled to a respective MEMS device, and each of the flexure elements can be configured to displace the respective MEMS device in at least one direction.