Patents by Inventor Michael D. Angerstein

Michael D. Angerstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing patterns in dielectric layers formed by plasma enhanced chemical vapor deposition (PECVD)
    Patent number: 4844945
    Abstract: A process for forming a dielectric patterned layer of any desired geometry on a selected substrate which includes vapor depositing selected reactants on said substrate only in areas thereon which are coextensive with the surface area of an adjacent metal electrode pattern.
    Type: Grant
    Filed: May 18, 1988
    Date of Patent: July 4, 1989
    Assignee: Hewlett-Packard Company
    Inventors: Eldurkar V. Bhaskar, Marzio A. Leban, Michael D. Angerstein