Abstract: A structurally-embedded electronics assembly is disclosed and includes an outer skin member which is lightly loaded structurally, a primary load-carrying member positioned inboard from the outer skin member, a core member positioned between the primary load-carrying member and the outer skin member, an intermediate skin member positioned between the outer skin member and the core member and an electronics structure positioned between a predetermined two of the members or intermingled with a predetermined number of the members set forth above which are adjacent each other. In another embodiment, a thermally conductive baseplate member is positioned inboard from the primary load-carrying member. In another embodiment, a vibration damping member is positioned inboard from the primary load-carrying member.

Abstract: A system for monitoring strains and stresses on rope structures and rigid structures containing the ropes is provided wherein a fiber optic is included in a rope structure and change in the fiber's light transmissive/reflective properties, which are caused by strains and stresses on the fiber, are monitored.