Patents by Inventor Michael D. Evans
Michael D. Evans has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6549409Abstract: A power converter assembly includes a heat sinking plate, a circuit board structure having a side that faces and is spaced by a gap from a surface of the heat sinking plate that is nearer to said side, a relatively thin, high heat density, dissipative semiconductor component mounted on said side, an encapsulating material filling the gap, and relatively taller, lower heat density, components mounted on the other side of the circuit board, the gap being characterized by an average thermal-resistance of less than 1° C.−in2/Watt.Type: GrantFiled: August 21, 2000Date of Patent: April 15, 2003Assignee: VLT CorporationInventors: John R. Saxelby, Jr., Michael D. Evans, Patrizio Vinciarelli
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Patent number: 6524645Abstract: A process for the metalization of substrates is disclosed. The metal either forms a coating over the entire substrate, or it is patternwise deposited on the substrate surface. Metal is patternwise formed on the substrate either by forming a pattern of resist material on the substrate and depositing the material in the interstices defined by the pattern or by forming a patterned resist layer over a metal layer and transferring the pattern into the substrate using conventional techniques. The patterned resist layer is formed on the substrate using conventional techniques. The substrate is treated with reagents that promote the electroless plating of metal on the substrate surface. If the resist material has been previously formed on the substrate surface, the substrate surface is then dried. The remaining resist is then removed from the substrate surface.Type: GrantFiled: October 18, 1994Date of Patent: February 25, 2003Assignee: Agere Systems Inc.Inventors: Michael D. Evans, Tae Yong Kim, Henry Hon Law, Te-Sung Wu
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Patent number: 6316737Abstract: In general, in one aspect, the invention features a connection between a through-hole in a circuit board and a contact region on a component. The contact region has a surface bearing a depression. A continuous solder column has one end of that forms a solder joint with an inner wall of the through-hole and the other end of that forms a solder joint with the contact region.Type: GrantFiled: September 9, 1999Date of Patent: November 13, 2001Assignee: VLT CorporationInventors: Michael D. Evans, James D. Goss, Jeffrey A. Curhan, Patrizio Vinciarelli
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Patent number: 6022823Abstract: An improved process for producing high activity and high selectivity supported palladium-gold catalysts is provided. The process involves calcining the support impregnated with a palladium salt and gold salt in a non-reducing atmosphere and at a temperature ranging from 100.degree. C. to 600.degree. C. prior to reducing the metals. Catalysts of the invention are useful for the production of vinyl acetate in the vapor phase by reaction of ethylene, acetic acid and oxygen.Type: GrantFiled: October 31, 1996Date of Patent: February 8, 2000Assignee: Millennium Petrochemicals, Inc.Inventors: Steven M. Augustine, David W. Smith, Ronnie M. Hanes, Michael D. Evans
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Patent number: 5730258Abstract: A bushing assembly (30) for a caliper disk brake includes a pair of bushings (32) opposingly disposed on a common centerline (34) in a caliper brake bolt bore (56). Each bushing (32) has a cylindrical body section (40) and a flange (50) extending from the body section (40). The body section (40) has a plurality of ribs (52) extending radially inward from the inner surface (54) of the body section (40) and a circumferential groove (60) in the outer surface (62) of the body section (40). The groove (60) is configured to seat a retainer ring (36) that prevents the bushing (32) from being ejected from the bolt bore (56) in which the bushings (32) are installed. The bushing assembly (30) prevents the caliper arm (16) from binding to the caliper bolts (18) when corrosion builds around the caliper bolt (18) by providing a space (72) between the second ends (44) of the bushings (32).Type: GrantFiled: July 19, 1996Date of Patent: March 24, 1998Inventor: Michael D. Evans
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Patent number: 5683758Abstract: A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.Type: GrantFiled: December 18, 1995Date of Patent: November 4, 1997Assignee: Lucent Technologies Inc.Inventors: Michael D. Evans, Tae Yong Kim, Henry Miles O'Bryan, Jr.
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Patent number: 5671515Abstract: A clasp (10) for connecting two items includes two interconnecting members (11, 12). One member (11) utilizes a rivet (14) to engage one of the items, for example, a golf towel (23). That member (11) also has a receiver (24) formed therein which has a slot (25). The other member (12) has a tab (28) with a flexible button (30) extending upwardly therefrom. The tab (28) is received in the slot (25) until the button (30) snaps up through an aperture (21) in the cover (18) of the receiver (24). The members (11, 12) are thus attached to each other but the attachment can be disengaged merely by depressing the button (30) and sliding the tab (28) out of the slot (25). The other end of the member (12) has a foldable flap (26) which can be formed into a loop (40) to engage another item, for example, a portion (39) of a golf bag.Type: GrantFiled: April 10, 1996Date of Patent: September 30, 1997Inventor: Michael D. Evans
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Patent number: 5509508Abstract: A device (10) is provided for a disc brake pad (11) having a backing plate (20) and actuated by a hydraulic piston (34). The retainer (10) includes tab members (14) for frictionally engaging the backing plate (20). Clip arms (16) are also provided for engaging the piston (34), and a shim (12) is provided to insulate the piston (34) from the backing plate (20). The tab members (14), clip arms (16) and shim (12) are integrated into a one-piece unit.Type: GrantFiled: May 5, 1994Date of Patent: April 23, 1996Assignee: Kateco, Inc.Inventor: Michael D. Evans
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Patent number: 5449955Abstract: A multilayer composite interconnection for use in circuits including thin film elements and electrical interconnections includes a copper barrier layer interposed between a nickel layer and a gold layer of the interconnection. The copper layer is in a thickness sufficient to bar or at least to restrict diffusion of nickel through the gold layer under processing and operating conditions. The interconnection multilayer composite interconnection includes in an ascending order, titanium, palladium or palladium-titanium alloy, copper, nickel, copper barrier and gold layers.Type: GrantFiled: April 1, 1994Date of Patent: September 12, 1995Assignee: AT&T Corp.Inventors: Richard P. Debiec, Michael D. Evans, Warren J. Pendergast
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Patent number: 5189808Abstract: A gauge for measuring the depth of a hole countersink in a workpiece for a fastener, or for measuring the protrusion height of a fastener head above the surface of the workpiece, includes a tapered cylindrical case for holding a transducer such as an LVDT, and a probe assembly removably mounted on the lower end of the case. The probe assembly includes a foot having an annular contact ring at its lower end for contacting the workpiece around the hole or around the fastener head to establish the reference position from which the measurement is to be taken. A probe is mounted in a well in the foot for axial sliding movement therein and is captured within the food by a connector which is screwed onto the upper end of the foot.Type: GrantFiled: June 3, 1991Date of Patent: March 2, 1993Assignee: The Boeing CompanyInventors: Michael D. Evans, Curtis L. Gnagy, William F. Herold, Christopher W. Lagerberg, Bruce W. Nelson
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Patent number: D357663Type: GrantFiled: March 16, 1994Date of Patent: April 25, 1995Assignee: Kateco, Inc.Inventor: Michael D. Evans