Abstract: In certain embodiments, a hot side heat exchanger (HSHX) includes a folded fin structure including a plurality of fins. Each of the plurality of fins is formed from a composite fin material having a first fin layer positioned between a second fin layer and a third fin layer, the first fin layer being a first material and the second and third fin layers being a second material. A base plate is in thermal communication with the plurality of folded fins. The base plate is formed from a composite base plate material having a first base plate layer and a second base plate layer, the first base plate layer being a first material and the second base plate layer being the second material. The first material has a greater thermal conductivity than the second material and the second material has greater corrosion resistance and high temperature strength than the first material.

Abstract: A thermoelectric refrigerator with a heat transfer system having a thermoelectric device and a heat exchanger with an evaporating surface and a condensing surface. A working fluid is sealed within the heat exchanger. The thermoelectric device includes a thermally conductive hot plate and a thermally conductive cold plate with thermoelectric elements disposed therebetween. The thermoelectric elements are preferably electrically coupled in series and thermally coupled in parallel. The evaporating surface of the heat exchanger is thermally coupled with the hot plate. A fluid flow path is provided to allow working fluid in its vapor phase to flow from the evaporating surface to the condensing surface and working fluid in its liquid phase to flow from the condensing surface to the evaporating surface. The configuration of the heat exchanger will optimize heat transfer by the working fluid from the thermoelectric device.

Abstract: A thermoelectric heat transfer system having a thermoelectric device and a heat exchanger with an evaporating surface and a condensing surface. A working fluid is sealed within the heat exchanger. The thermoelectric device includes a thermally conductive hot plate and a thermally conductive cold plate with thermoelectric elements disposed therebetween and the thermoelectric elements are electrically coupled in series and thermally coupled in parallel. The evaporating surface of the heat exchanger is thermally coupled with the hot plate. A fluid flow path to allow working fluid in its vapor phase to flow from the evaporating surface to the condensing surface and working fluid in its liquid phase to flow from the condensing surface to the evaporating surface.

Abstract: Fault tolerant thermoelectric device circuit (18) is provided including a plurality of thermoelectric elements (19, 20, 21, and 22) and a plurality of secondary by-pass circuits (24, 25, 26, and 27) coupled in parallel with a number of the thermoelectric elements. The secondary by-pass circuits provide by-pass paths to failed thermoelectric elements, thereby allowing the remaining elements to continue operating. Primary by-pass circuit (30) is also provided to provide a by-pass path to all of the thermoelectric elements as required.

Abstract: A refrigerator is provided which combines the benefits of superinsulation materials with thermoelectric devices and phase change materials to provide an environmentally benign system that is energy efficient and can maintain relatively uniform temperatures for extended periods of time with relatively low electrical power requirements. The refrigerator includes a thermoelectric assembly having a thermoelectric device with a hot sink and a cold sink. The superinsulation materials include a plurality of vacuum panels. The refrigerator is formed from an enclosed structure having a door. The vacuum panels may be contained within the walls of the enclosed structure and the door. By mounting the thermoelectric assembly on the door, the manufacturer of the enclosed structure is simplified and the overall R rating of the refrigerator increased. Also an electrical motor and propellers may be mounted on the door to assist in the circulation of air to improve the efficiency of the cold sink and the hot sink.

Abstract: Apparatus including a power supply (202) and control system is provided for maintaining the temperature within an enclosed structure (40) using thermoelectric devices (92). The apparatus may be particularly beneficial for use with a refrigerator (20) having superinsulation materials (46) and phase change materials (112) which cooperate with the thermoelectric device (92) to substantially enhance the overall operating efficiency of the refrigerator (20). The electrical power supply (202) and control system allows increasing the maximum power capability of the thermoelectric device (92) in response to increased heat loads within the refrigerator (20). The electrical power supply (202) and control system may also be used to monitor the performance of the cooling system (70) associated with the refrigerator (20).

Abstract: A superinsulation panel and thermoelectric assembly are provided to maintain the temperature within a refrigerator or other type of enclosed structure at a desired value. The thermoelectric assembly includes a thermoelectric device having a hot sink and a cold sink. The superinsulation panel is preferably disposed between the hot sink and the cold sink. A cold finger is positioned within the superinsulation panel to transfer heat energy from the cold sink to the thermoelectric device which in turn transfers the heat energy to the hot sink. A plurality of posts may also be disposed within the superinsulation panel for use in coupling the thermoelectric assembly with the superinsulation panel.

Abstract: An encapsulated thermoelectric heat pump, apparatus and method for manufacturing the encapsulated thermoelectric heat pump is disclosed. The encapsulated thermoelectric heat pump includes a plurality of spaced n-type and p-type thermoelectric elements arranged alternatively in rows and columns. The thermoelectric elements having opposing ends operatively connected to first and second metalized ceramic substrates. The first and second metalizations patterned to connect serially the thermoelectric elements. The space between the spaced thermoelectric elements is filled with a microballoon filled epoxy for substantially increasing the strength of the thermoelectric heat pump to withstand a stress of more than 2000 g's.