Patents by Inventor Michael D. Goulet

Michael D. Goulet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conduction cooling of multi-channel flip chip based panel array circuits
    Patent number: 8780561
    Abstract: A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: July 15, 2014
    Assignee: Raytheon Company
    Inventors: Paul A. Danello, Richard A. Stander, Michael D. Goulet
  • CONDUCTION COOLING OF MULTI-CHANNEL FLIP CHIP BASED PANEL ARRAY CIRCUITS
    Publication number: 20130258599
    Abstract: A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Applicant: Raytheon Company
    Inventors: Paul A. Danello, Richard A. Stander, Michael D. Goulet