Patents by Inventor Michael D. Haines

Michael D. Haines has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9845025
    Abstract: The rigid T-rail conductor system is configured to support a contact wire in an overhead railway electrification system. The rigid T-rail includes a first rail configured to be disposed in an overhead position of the railway electrification system. The rigid rail includes a keeper disposed on a side of the first rail, the keeper configured to be movable. When the keeper is in the first position, the keeper holds and affixes the wire on the first rail. When the keeper is in the second position, the keeper allows the wire to be installed or to be removed from the rail.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: December 19, 2017
    Assignee: AFL Telecommunications LLC
    Inventors: David Eric Parsons, James Logan, Michael D. Haines
  • Patent number: 7833838
    Abstract: A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy material is provided on the substrate upon which the microprocessor is mounted. The gasket surrounds the microprocessor to protect it from electrostatic discharge pulses. A heat spreader is arranged in heat conducting relation with the microprocessor and atop at least a portion of the gasket adjacent the die. The material is a static dissipative material having a volume resistivity of greater than 102 ohm cm and a shielding effectiveness to protect the microprocessor from at least 4 kV of electrostatic discharge pulse at the computer system level in which the microprocessor is to be used.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: November 16, 2010
    Assignee: Intel Corporation
    Inventor: Michael D. Haines
  • Patent number: 7030482
    Abstract: A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy material is provided on the substrate upon which the microprocessor is mounted. The gasket surrounds the microprocessor to protect it from electrostatic discharge pulses. A heat spreader is arranged in heat conducting relation with the microprocessor and atop at least a portion of the gasket adjacent the die. The material is a static dissipative material having a volume resistivity of greater than 102 ohm cm and a shielding effectiveness to protect the microprocessor from at least 4 kV of electrostatic discharge pulse at the computer system level in which the microprocessor is to be used.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: April 18, 2006
    Assignee: Intel Corporation
    Inventor: Michael D. Haines
  • Publication number: 20030116830
    Abstract: A method and apparatus for increasing the immunity of new generation microprocessors from electrostatic discharge events involve shielding the microprocessors at the die level. A gasket of a lossy material is provided on the substrate upon which the microprocessor is mounted. The gasket surrounds the microprocessor to protect it from electrostatic discharge pulses. A heat spreader is arranged in heat conducting relation with the microprocessor and atop at least a portion of the gasket adjacent the die. The material is a static dissipative material having a volume resistivity of greater than 102 ohm cm and a shielding effectiveness to protect the microprocessor from at least 4 kV of electrostatic discharge pulse at the computer system level in which the microprocessor is to be used.
    Type: Application
    Filed: December 21, 2001
    Publication date: June 26, 2003
    Inventor: Michael D. Haines