Abstract: A laminated flip-chip interconnect package comprising a substrate having a chip attach surface and a board attach surface that define contact pads for attachment to corresponding pads on the chip and board wherein the substrate board surface comprises at least one solid plane covering the chip attach surface region near at least one chip corner. In one embodiment, the solid plane comprises a dielectric material, optionally covered with a soldermask or coverlay material. In an alternate embodiment, the solid plane comprises a metal, optionally covered with a soldermask or coverlay material.

Abstract: An interconnect module providing conductive interconnection paths between an integrated chip, a printed wiring board, and at least one layer within the module, incorporating a plurality of alternating dielectric and conductive layers laminated together to form a unitary structure. The module includes a chip attach surface and a board attach surface, that define contact pads for attachment to corresponding pads on the chip and printed wiring board, respectively, by means of solder balls.