Abstract: Methods and systems for detection of selected defects in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to inspection data acquired across an area on a substrate to determine a first portion of the inspection data that has a higher probability of being a selected type of defect than a second portion of the inspection data. The selected type of defect includes a non-point defect. The inspection data is generated by combining two or more raw inspection data corresponding to substantially the same locations on the substrate. The method also includes generating a two-dimensional map illustrating the first portion of the inspection data. The method further includes searching the two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect and determining if the event corresponds to a defect having the selected type.

Abstract: Methods and systems for detection of selected defects in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to inspection data acquired across an area on a substrate to determine a first portion of the inspection data that has a higher probability of being a selected type of defect than a second portion of the inspection data. The selected type of defect includes a non-point defect. The inspection data is generated by combining two or more raw inspection data corresponding to substantially the same locations on the substrate. The method also includes generating a two-dimensional map illustrating the first portion of the inspection data. The method further includes searching the two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect and determining if the event corresponds to a defect having the selected type.

Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.

Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.

Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.

Abstract: A wafer having improved inspection sensitivity to foreign matter on a top-most surface of the wafer, as detected with a surface scanning optical inspection system that uses an inspection wavelength. The wafer includes a substantially homogenous first layer at the top-most surface of the wafer, the first layer having a first thickness. The first layer is at least partially transparent to the inspection wavelength. A substantially homogenous second layer immediately underlies the first layer, the second layer having a second thickness. The second layer is at least partially transparent to the inspection wavelength. A substrate immediately underlies the second layer. The first thickness and the second thickness are set in a combination that produces a local minimum of an electric field at the top-most surface and a local maximum of an electric field within one hundred nanometers above the top-most surface.

Abstract: Various methods and systems for detection of selected defects particularly in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to raw inspection data acquired across an area on a substrate to determine a first portion of the raw inspection data that has a higher probability of being a selected type of defect than a second portion of the raw inspection data. The selected type of defect includes a non-point defect. The method also includes generating a raw two-dimensional map illustrating the first portion of the raw inspection data. In addition, the method includes searching the raw two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect. The method further includes determining if the event corresponds to a defect having the selected type.

Abstract: Various methods and systems for detection of selected defects particularly in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to raw inspection data acquired across an area on a substrate to determine a first portion of the raw inspection data that has a higher probability of being a selected type of defect than a second portion of the raw inspection data. The selected type of defect includes a non-point defect. The method also includes generating a raw two-dimensional map illustrating the first portion of the raw inspection data. In addition, the method includes searching the raw two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect. The method further includes determining if the event corresponds to a defect having the selected type.

Abstract: A single-axis active vibration reducing system for reducing vibrations in an object in a single axis. The vibration isolation system enables the sensing of motion of the center of mass of an object along a single axis and, with the proper positioning of a single sensor-actuator pair with feedback operation, the dampening of vibrations of the object along that axis. Due to the positioning and alignment of the actuator, the vibration isolation system of the present invention does not introduce appreciable off-axis vibration. The vibration reducing system includes an actuator positioned on the object to impart an actuation force along an actuator axis to reduce vibrations of the object in the vibrational axis without imparting substantial motion to the object other than in the vibrational axis.

Abstract: A large scale horizontal translation stage for a microscope or other instrument particularly a scanning probe microscope is disclosed. The translation stage is provided with air bearings which allow it to float over a planar surface. The translation stage is kinematically mounted on a guiding member such that the horizontal position of the translation stage is defined by the guiding member but the translation stage is free to move in a direction perpendicular to the planar surface. To position a sample, the air bearings are actuated and the guiding member moves the translation stage to a desired position. An attractive force, preferably suction in the air bearings, is then applied to hold the translation stage firmly against the supporting surface while the sample is analyzed. The preferred embodiment includes two optical microscopes.

Abstract: A scanning probe microscope having numerous advantages is disclosed. Respective scanning force and scanning tunneling probes are removably mounted in the head using kinematic mounting techniques so that they may be substituted for one another without the need to adjust the cantilever deflection sensor. A linear position-sensitive photodetector in the deflection sensor eliminates further the need for adjustments. A motorized, non-stacked x,y coarse movement stage is kinematically positioned with respect to the base and features a minimized mechanical loop to reduce thermal and vibrational effects on the position of the sample. A z coarse movement stage positions the head kinematically with respect to the base and includes a motorized drive means which allows the height, tilt and pitch of the probe to be adjusted. The scanner includes x,y and z sample position detectors which provide an accurate measurement of the position of the sample with respect to the probe.

Abstract: A cantilever for a scanning probe microscope is disclosed. The cantilever includes a piezoresistor for detecting the deflection of the cantilever, and a tip which is formed integrally with the cantilever. A process of fabricating such a cantilever is also disclosed, the process yielding a tip which has a high aspect ratio and a small radius of curvature at its apex. A combined atomic force/lateral force microscope including two or more piezoresistors responsive to both the bending and torsion of the cantilever is also disclosed.

Abstract: A scanning probe microscope having numerous advantages is disclosed. Respective scanning force and scanning tunneling probes are removably mounted in the head using kinematic mounting techniques so that they may be substituted for one another without the need to adjust the cantilever deflection sensor. A linear position-sensitive photodetector in the deflection sensor eliminates further the need for adjustments. A motorized, non-stacked x,y coarse movement stage is kinematically positioned with respect to the base and features a minimized mechanical loop to reduce thermal and vibrational effects on the position of the sample. A z coarse movement stage positions the head kinematically with respect to the base and includes a motorized drive means which allows the height, tilt and pitch of the probe to be adjusted. The scanner includes x,y and z sample position detectors which provide an accurate measurement of the position of the sample with respect to the probe.

Abstract: A scanning force microscope having a sensor head and a base wherein a moveable sample holder is housed in the base and is positioned relative to a probe housed in the sensor head, such sample being monitored by an optical deflection detection system. The detection system is configured to provide direct visual observation of the probe with respect to the sample. The mirror of the detection system is mounted in a cut away portion of a sphere and defines the axis of rotation of a kinematic mount, such providing ease of fine adjustment of the detection system. The sensor head is in communication with the base by a stage kinematic mount, such providing ease of position adjustment of the sensor head with respect to the base.

Abstract: A scanning force microscope having a sensor head and a base wherein a moveable sample holder is housed in the base and is positioned relative to a probe housed in the sensor head, such sample being monitored by an optical deflection detection system. The detection system is configured to provide direct visual observation of the probe with respect to the sample. The mirror of the detection system is mounted in a cut away portion of a sphere and defines the axis of rotation of a kinematic mount, such providing ease of fine adjustment of the detection system. The sensor head is in communication with the base by a stage kinematic mount, such providing ease of position adjustment of the sensor head with respect to the base.