Patents by Inventor Michael D. Prevallet

Michael D. Prevallet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedded capacitors and methods for their fabrication and connection
    Patent number: 7361568
    Abstract: Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymerlayer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: April 22, 2008
    Assignee: Motorola, Inc.
    Inventors: Gregory J. Dunn, Remy J. Chelini, Robert T. Croswell, Philip M. Lessner, Michael D. Prevallet, John D. Prymak