Abstract: A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.

Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

Abstract: A hot melt pressure sensitive adhesive composition comprises: (a) a block copolymer comprising a first polymer block comprising an ethylene residue and a second polymer block comprising a C1 to C4 alkyl acrylate residue, wherein the block copolymer has a melt index as measured in accordance with ASTM D1238 of between about 0.1 and about 250 g/10 min; (b) a tackifying resin; and (c) a plasticizer. A method for making a laminate comprises the steps of: applying the hot melt pressure sensitive adhesive composition of the invention in a molten state to a primary substrate and allowing the adhesive to cool to form a bond with said primary substrate. Certain adhesives the invention perform comparably to certain styrene block copolymer adhesives, but provides an alternative polymer source.

Abstract: A hot melt adhesive that is composed of a metallocene catalyzed polyethylene polymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a solid plasticizer. The preferred polyethylene polymer is an ethylene-octene copolymer, and the preferred styrenic block copolymer is a styrene-ethylene-butylene-styrene having less than 30% styrene content. The preferred solid plasticizer is either glycerol tribenzoate or 1,4-cyclohexane dimethanol dibenzoate.

Abstract: A hot melt adhesive comprises a polylactide homopolymer or copolymer, such as polylactic acid; sulfonated copolyester; and at least one plasticizer, and is compostable. The plasticizer may be a solid plasticizer, such as a benzoate, and a second plasticizer may also be used. The adhesive is suitable for use in a variety of applications, such as case and carton applications, use with burlap or other compostable substrates for tree bulbs or plant seeds, and use with other compostable films, and is especially appropriate for dual-walled paperboard beverage cups. The adhesive demonstrates good bond performance comparable to non-compostable adhesives over a range of temperatures, reflective of the temperatures of hot and cold beverages.

Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear.

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

Abstract: A hot applied, non-crosslinking, non-butyl, sealant. These sealants are composed of olefin polymers, styrenic block copolymers, an ethylene vinyl acetate copolymer, tackifying resins, plasticizers, and preferably inorganic fillers, and organosilane adhesion promoters. Optionally, the sealant may include UV absorbers, antioxidants, pigments, and the like. The sealants are suitable for use as edge sealants for insulated glass (IG) window units.

Abstract: A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.

Abstract: A hot applied, non-crosslinking, non-butyl, sealant. These sealants are composed of olefin polymers, styrenic block copolymers, an ethylene vinyl acetate copolymer, tackifying resins, plasticizers, and preferably inorganic fillers, and organosilane adhesion promoters. Optionally, the sealant may include UV absorbers, antioxidants, pigments, and the like. The sealants are suitable for use as edge sealants for insulated glass (IG) window units.

Abstract: A non-pressure sensitive hot melt adhesive for use in mailer applications uses a styrenic block copolymer (SBC) with a hydrogenated mid-block as the primary polymer in the composition. The adhesive contains about 10% to about 50% by weight of the SBC, about 2% to about 30% by weight of a polyolefin polymer as a secondary polymer in the composition, about 10% to about 70% by weight of a suitable plasticizer, about 0% to about 30% by weight of a wax, about 0% to about 50% by weight of one or more tackifying resins, about 0.1% to about 4% by weight of a stabilizer, and about 0% to about 3% by weight of auxiliary additives, so that the viscosity of the composition is equal to or less than about 10,000 cP at 163° C. The formulation balances the cohesive and adhesive strength required to insure the adhesive fails cohesively to prevent paper tear.

Abstract: A hot melt adhesive composition containing a functionalized polymer, namely, a metallocene catalyzed polyolefin elastomer grafted with maleic anhydride, together with a non-functionalized secondary polymer, namely, a metallocene catalyzed random or block polyolefin elastomer having a melt index equal to or greater than 15, a first tackifying resin having a softening point of at least 95° C., and a wax. The composition may optionally include an aromatic reinforcing resin having a softening point equal to or higher than 115° C., and a plasticizer. These hot melts provide superior hot tack, excellent adhesion, flexibility, and heat resistance above 150° F. in applications such as rigid packaging, hot fill packaging, and bottle labeling.

Abstract: A hot melt desiccant matrix composition has an organic binder and an absorbent material as components thereof. The organic binder includes about 10% to 80% by weight of a propylene based poly-?-olefin polymer having a melting point or a glass transition temperature less than 180° C., a density in the range of 0.85 to 0.95 g/cc or a blend of poly-?-olefin polymers; about 5% to 70% by weight of a plasticizer having a flash point equal to or greater than 180° C.; about 0% to 50% by weight a compatible tackifier; and a stabilizer in the amount of about 0% to 5% by weight. The absorbent component may be a water/moisture absorbing material, or a VOC absorbing material, or a blend of water/moisture absorbing and VOC absorbing materials. The absorbent material is selected from absorbing materials including, but not limited to, silica gels, activated carbons, silica alumina, calcium sulfate, calcium oxide, natural zeolites and molecular sieves and the mixtures thereof.

Abstract: A hot melt adhesive that is composed of a metallocene catalyzed polyethylene polymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a solid plasticizer. The preferred polyethylene polymer is an ethylene-octene copolymer, and the preferred styrenic block copolymer is a styrene-ethylene-butylene-styrene having less than 30% styrene content. The preferred solid plasticizer is either glycerol tribenzoate or 1,4-cyclohexane dimethanol dibenzoate.

Abstract: A hot melt desiccant matrix composition has an organic binder and an absorbent material as components thereof. The organic binder includes about 10% to 80% by weight of a propylene based poly-?-olefin polymer having a melting point or a glass transition temperature less than 180° C., a density in the range of 0.85 to 0.95 g/cc or a blend of poly-?-olefin polymers; about 5% to 70% by weight of a plasticizer having a flash point equal to or greater than 180° C.; about 0% to 50% by weight a compatible tackifier; and a stabilizer in the amount of about 0% to 5% by weight. The absorbent component may be a water/moisture absorbing material, or a VOC absorbing material, or a blend of water/moisture absorbing and VOC absorbing materials. The absorbent material is selected from absorbing materials including, but not limited to, silica gels, activated carbons, silica alumina, calcium sulfate, calcium oxide, natural zeolites and molecular sieves and the mixtures thereof.