Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. The PMUT is also configured to operate in a Surface Acoustic Wave (SAW) mode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/SAW dual-mode devices, and a PMUT/SAW dual-mode device.

Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.

Abstract: A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image.

Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

Abstract: A method for generating a composite image having an increased image pixel density by an array of ultrasonic transducers having a given spatial density is provided. The method comprises capturing a first set of pixels at an ultrasonic sensor using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of ultrasonic transducers. The first beamforming pattern and the second beamforming pattern are different. Pixels of the second set of pixels correspond to positions between pixels of the first set of pixels. The method additionally comprises combining the first and second sets of pixels to form the composite image. An electronic device and a method of generating an image of a fingerprint are also provided.

Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

Abstract: A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image.

Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.

Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

Abstract: A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image.

Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.

Abstract: An electronic device including an array of ultrasonic transducers, a temperature sensor for determining a temperature of the array of ultrasonic transducers, and a control module communicatively coupled to the array of ultrasonic devices and the temperature sensor. The control module is for receiving the temperature and for controlling operation of the array of ultrasonic transducers based at least in part on the temperature.

Abstract: A method for generating a composite image having an increased image pixel density by an array of ultrasonic transducers having a given spatial density is provided. The method comprises capturing a first set of pixels at an ultrasonic sensor using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of ultrasonic transducers. The first beamforming pattern and the second beamforming pattern are different. Pixels of the second set of pixels correspond to positions between pixels of the first set of pixels. The method additionally comprises combining the first and second sets of pixels to form the composite image. An electronic device and a method of generating an image of a fingerprint are also provided.

Abstract: A method for generating an image is provided. The method comprises capturing a first set of image pixels by an ultrasonic sensor comprising an array of ultrasonic transducers using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of transmit signals routed to a plurality of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of image pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of transmit signals routed to the plurality of ultrasonic transducers. The second beamforming pattern is different than the first beamforming pattern. The second set of image pixels corresponds to an edge region of the ultrasonic sensor. The method additionally comprises combining the first set of image pixels and the second set of image pixels to form the image.

Abstract: Microelectromechanical microphones include structures that permit differential capacitive sensing. In certain structures, a movable plate is disposed between a rigid plate and a substrate. A first capacitor is formed between the movable plate and the substrate and a second capacitor is formed between the movable plate and the rigid plate. Respective bias voltages can be applied to the rigid plate and the substrate, and a differential capacitive signal can be probed in response to displacement of the movable plate caused by a pressure wave. The movable plate and the rigid plate are mechanically coupled to first and second portions of the substrate, respectively. A dielectric member mechanically couples the movable plate and the rigid plate, thus providing mechanical stability.

Abstract: An electronic device including an array of ultrasonic transducers, a temperature sensor for determining a temperature of the array of ultrasonic transducers, and a control module communicatively coupled to the array of ultrasonic devices and the temperature sensor. The control module is for receiving the temperature and for controlling operation of the array of ultrasonic transducers based at least in part on the temperature.

Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. The PMUT is also configured to operate in a Surface Acoustic Wave (SAW) mode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/SAW dual-mode devices, and a PMUT/SAW dual-mode device.

Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.