Patents by Inventor Michael Davenport

Michael Davenport has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250202193
    Abstract: A photonic element includes a bottom cladding, a top cladding and a first waveguide that is located between the bottom and top claddings. A first multi-wavelength grating is optically coupled with the first waveguide. The multi-wavelength grating is characterized by a grating strength that varies along a first axis based on a piecewise mathematical function. The first waveguide and the multi-wavelength grating collectively enable an output having a plurality of wavelengths.
    Type: Application
    Filed: February 18, 2025
    Publication date: June 19, 2025
    Inventor: Michael DAVENPORT
  • Publication number: 20250050912
    Abstract: Techniques and methods for crosswalk handling for vehicles. The vehicle may identify a crosswalk and an object associated with the crosswalk in the environment. The vehicle may determine a heatmap based on sensor data and map data. The vehicle may determine a factor associated with the crosswalk relative to one or more of the vehicle and/or object based on the heatmap associated with the crosswalk. The vehicle may determine a cost associated with the crosswalk based on the factor. The vehicle may determine a trajectory for the vehicle to operate in the environment based on the cost associated with the crosswalk and follow the trajectory to travel in the environment.
    Type: Application
    Filed: August 11, 2023
    Publication date: February 13, 2025
    Inventors: Andrew Baker, Clark Michael Davenport, Rasmus Fonseca, Joseph Lorenzetti, Wentao Zhong
  • Patent number: 12097187
    Abstract: Abuse deterrent solid dosage formulations containing 5-({[2-Amino-3-(4-carbamoyl-2,6 -dimethyl-phenyl)-propionyl]-[1-(4-phenyl-1H-imidazol-2-yl)-ethyl]-amino}-methyl)-2-methoxy -benzoic acid, and processes for the preparation and administration of these formulations.
    Type: Grant
    Filed: May 26, 2023
    Date of Patent: September 24, 2024
    Assignee: Allergan Holdings Unlimited Company
    Inventors: Tim Costello, Leonard Scott Dove, J. Michael Davenport, Gail McIntyre, Paul Covington, David Andrae
  • Patent number: 12046871
    Abstract: Integrated-optics systems are presented in which an optically active device is optically coupled with a silicon waveguide via a passive compound-semiconductor waveguide. In a first region, the passive waveguide and the optically active device collectively define a composite waveguide structure, where the optically active device functions as the central ridge portion of a rib-waveguide structure. The optically active device is configured to control the vertical position of an optical mode in the composite waveguide along its length such that the optical mode is optically coupled into the passive waveguide with low loss. The passive waveguide and the silicon waveguide collectively define a vertical coupler in a second region, where the passive and silicon waveguides are configured to control the distribution of the optical mode along the length of the coupler, thereby enabling the entire mode to transition between the passive and silicon waveguides with low loss.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: July 23, 2024
    Assignee: Quintessent Inc.
    Inventors: Brian Koch, Michael Davenport, Alan Liu, Justin Colby Norman
  • Patent number: 11914203
    Abstract: A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: February 27, 2024
    Assignee: Ayar Labs, Inc.
    Inventors: Michael Davenport, Mark Wade, Chong Zhang
  • Publication number: 20240061181
    Abstract: A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Shahab Ardalan, Michael Davenport, Roy Edward Meade
  • Publication number: 20240014904
    Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
    Type: Application
    Filed: September 20, 2023
    Publication date: January 11, 2024
    Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
  • Publication number: 20240007192
    Abstract: The present disclosure is directed toward architectures that combine DWDM and CWDM concepts in a single PIC. Transmitter stages in accordance with the present disclosure include a plurality of multiwavelength lasers having regions of separately grown epitaxial material whose gain peaks are centered at different wavelengths. Each laser launches a wavelength comb comprising a plurality of wavelength signals into a PLC, where the wavelengths within each wavelength comb are separated by a wavelength spacing that is smaller than that between adjacent wavelength combs. In some embodiments, the PLC includes modulator banks for encoding data on the wavelength signals and combining them to produce a composite DWDM output signal. In some embodiments, a receiver stage is included for demultiplexing a composite DWDM input signal and detecting each wavelength channel within it.
    Type: Application
    Filed: January 18, 2023
    Publication date: January 4, 2024
    Inventors: Michael DAVENPORT, Chris COLE, Brian KOCH, Alan LIU
  • Patent number: 11822128
    Abstract: A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: November 21, 2023
    Assignee: Ayar Labs, Inc.
    Inventors: Shahab Ardalan, Michael Davenport, Roy Edward Meade
  • Publication number: 20230353251
    Abstract: The present disclosure is directed toward architectures that combine DWDM and CWDM concepts in a single PIC. Transmitter stages in accordance with the present disclosure include a plurality of multiwavelength lasers having regions of separately grown epitaxial material whose gain peaks are centered at different wavelengths. Each laser launches a wavelength comb comprising a plurality of wavelength signals into a PLC, where the wavelengths within each wavelength comb are separated by a wavelength spacing that is smaller than that between adjacent wavelength combs. In some embodiments, the PLC includes modulator banks for encoding data on the wavelength signals and combining them to produce a composite DWDM output signal. In some embodiments, a receiver stage is included for demultiplexing a composite DWDM input signal and detecting each wavelength channel within it.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 2, 2023
    Inventors: Michael DAVENPORT, Brian KOCH, Alan LIU
  • Patent number: 11799554
    Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
    Type: Grant
    Filed: July 16, 2022
    Date of Patent: October 24, 2023
    Assignee: Ayar Labs, Inc.
    Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
  • Patent number: 11733457
    Abstract: Integrated-optics systems are presented in which an active-material stack is disposed on a coupling layer in a first region to collectively define an OA waveguide that supports an optical mode of a light signal. The coupling layer is patterned to define a coupling waveguide and a passive waveguide, which are formed as two abutting, optically coupled segments of the coupling layer. The lateral dimensions of the active-material stack are configured to control the shape and vertical position of the optical mode at any location along the length of the OA waveguide. The active-material stack includes a taper that narrows along its length such that the optical mode is located completely in the coupling waveguide where the coupling waveguide abuts the passive waveguide. In some embodiments, the passive layer is optically coupled with the OA waveguide and a silicon waveguide, thereby enabling light to propagate between them.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: August 22, 2023
    Assignee: Quintessent Inc.
    Inventors: Brian Koch, Michael Davenport, Alan Liu
  • Patent number: 11697945
    Abstract: A filter assembly for filtering water in spas, swimming pools, hot tubs and whirlpools, having a first or outer filter element, a second or inner filter element removably installed within the outer filter element, a first coupling member associated with the outer filter element, a second coupling member associated with the inner filter element, the first and second coupling members engaging one another to connect the inner filter element with the outer filter element, and a releasable detent arrangement resisting disengagement of the first and second coupling members from one another. The outer filter element includes a filter medium for mechanically removing particulates from a fluid to be treated and the inner filter element includes a filter medium containing fluid purifying particles.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: July 11, 2023
    Assignee: Masterspas, LLC
    Inventors: Nathan Coelho, Michael Davenport, Richard Medina, Abhilash Pillai, Rakshith Asokan
  • Publication number: 20230168431
    Abstract: The present disclosure is directed toward photonic elements comprising rib-waveguide-based ring resonators having high coupling efficiency between their bus and ring waveguides within the coupling region of the ring resonator, as well as operability over a wide spectral range. Embodiments disclosed herein employ a small-diameter ring waveguide and a bus waveguide that collectively define an asymmetrical coupler having a coupling region at which the optical confinement of the bus waveguide is stronger on side of the bus waveguide distal to the ring waveguide than on the side of the bus waveguide that is proximal to the ring waveguide. In some embodiments, in the coupling region, the bus waveguide has ridge and an inner bus-slab portion that is shared with the ring waveguide, while the outer bus-slab portion is at least partially removed to give rise to stronger optical confinement at the outer edge of the ridge of the bus waveguide.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 1, 2023
    Inventors: Justin Colby NORMAN, Michael DAVENPORT, Michael Lawrence BELT
  • Patent number: 11631967
    Abstract: Integrated-optics systems are presented in which an optically active device is optically coupled with a silicon waveguide via a passive compound-semiconductor waveguide. In a first region, the passive waveguide and the optically active device collectively define a composite waveguide structure, where the optically active device functions as the central ridge portion of a rib-waveguide structure. The optically active device is configured to control the vertical position of an optical mode in the composite waveguide along its length such that the optical mode is optically coupled into the passive waveguide with low loss. The passive waveguide and the silicon waveguide collectively define a vertical coupler in a second region, where the passive and silicon waveguides are configured to control the distribution of the optical mode along the length of the coupler, thereby enabling the entire mode to transition between the passive and silicon waveguides with low loss.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: April 18, 2023
    Assignee: Quintessent Inc.
    Inventors: Brian Koch, Michael Davenport, Alan Liu, Justin Colby Norman
  • Publication number: 20230109277
    Abstract: Integrated-optics systems are presented in which an optically active device is optically coupled with a silicon waveguide via a passive compound-semiconductor waveguide. In a first region, the passive waveguide and the optically active device collectively define a composite waveguide structure, where the optically active device functions as the central ridge portion of a rib-waveguide structure. The optically active device is configured to control the vertical position of an optical mode in the composite waveguide along its length such that the optical mode is optically coupled into the passive waveguide with low loss. The passive waveguide and the silicon waveguide collectively define a vertical coupler in a second region, where the passive and silicon waveguides are configured to control the distribution of the optical mode along the length of the coupler, thereby enabling the entire mode to transition between the passive and silicon waveguides with low loss.
    Type: Application
    Filed: December 1, 2022
    Publication date: April 6, 2023
    Inventors: Brian KOCH, Michael DAVENPORT, Alan LIU, Justin Colby NORMAN
  • Publication number: 20230048527
    Abstract: Coupled-cavity waveguide reflectors suitable for use in high-Q reflective spectral filters, narrow-linewidth lasers, and the like, are presented. Coupled-cavity waveguide reflectors in accordance with the present disclosure comprise multiple waveguide segments arranged in a series, each segment including a tooth having relatively higher refractive index and a gap having relatively lower refractive index, where the lengths of the teeth and gaps are based on the position of their respective segments in the series. The lengths of the teeth and gaps are selected such that the reflectivity of the segments align at only a single wavelength, thereby enabling very narrow-linewidth operation.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 16, 2023
    Inventor: Michael DAVENPORT
  • Publication number: 20220390691
    Abstract: A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.
    Type: Application
    Filed: August 22, 2022
    Publication date: December 8, 2022
    Inventors: Michael Davenport, Mark Wade, Chong Zhang
  • Publication number: 20220360336
    Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
    Type: Application
    Filed: July 16, 2022
    Publication date: November 10, 2022
    Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
  • Patent number: 11422322
    Abstract: A substrate includes a first area in which a laser array chip is disposed. The substrate includes a second area in which a planar lightwave circuit is disposed. The second area is elevated relative to the first area. A trench is formed in the substrate between the first area and the second area. The substrate includes a third area in which an optical fiber alignment device is disposed. The third area is located next to and at a lower elevation than the second area within the substrate. The planar lightwave circuit has optical inputs facing toward and aligned with respective optical outputs of the laser array chip. The planar lightwave circuit has optical outputs facing toward the third area. The optical fiber alignment device is configured to receive optical fibers such that optical cores of the optical fibers respectively align with the optical outputs of the planar lightwave circuit.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: August 23, 2022
    Assignee: Ayar Labs, Inc.
    Inventors: Michael Davenport, Mark Wade, Chong Zhang