Abstract: The present invention relates to a method for fabricating a semiconductor device for stimulation and/or data recording of biological material to a such semiconductor device. The method comprises providing a semiconductor substrate comprising a first insulating layer; providing a patterned conductive layer on top of the first insulating layer; depositing and patterning a second insulating layer atop the patterned conductive layer; growing carbon nano-sheets atop the second insulating layer; and defining carbon nano-sheet electrode areas on the second insulating layer by etching away the carbon nano-sheets outside of the carbon nano-sheet electrode areas.

Abstract: Disclosed are methods for fabricating pyrolysed carbon nanostructures. An example method includes providing a substrate, depositing a polymeric material, subjecting the polymeric material to a plasma etching process to form polymeric nanostructures, and pyrolysing the polymeric nanostructures to form carbon nanostructures. The polymeric material comprises either compounds with different plasma etch rates or compounds that can mask a plasma etching process. The plasma etching process may be an oxygen plasma etching process.

Abstract: Disclosed are methods for fabricating pyrolysed carbon nanostructures. An example method includes providing a substrate, depositing a polymeric material, subjecting the polymeric material to a plasma etching process to form polymeric nanostructures, and pyrolysing the polymeric nanostructures to form carbon nanostructures. The polymeric material comprises either compounds with different plasma etch rates or compounds that can mask a plasma etching process. The plasma etching process may be an oxygen plasma etching process.

Abstract: The present invention relates to a method for fabricating a semiconductor device for stimulation and/or data recording of biological material to a such semiconductor device. The method comprises providing a semiconductor substrate comprising a first insulating layer; providing a patterned conductive layer on top of the first insulating layer; depositing and patterning a second insulating layer atop the patterned conductive layer; growing carbon nano-sheets atop the second insulating layer; and defining carbon nano-sheet electrode areas on the second insulating layer by etching away the carbon nano-sheets outside of the carbon nano-sheet electrode areas.

Abstract: Present invention involves a seal means suitable to replace the classic seals. For instance the seal means of present invention can be a liquid seal ring (7) to replace the classic rubber seal rings. Such is liquid O-ring can be adapted to resists the actuation pressure relying on surface tension forces. Such liquid O-rings can also be linked in series, hereby increasing the maximum seal pressure. In a preferred embodiment the seal means of present invention comprises two major components, a surface tension seal (7) and a pressure divider (4). The pressure divider will comprise a system that generates a pressure drop. Such pressure divider can be located before the surface tension seal and perform the first pressure drop. The combination of these two systems has the advantage that the surface tension seal is able to reduce the leakage to zero or essentially zero and that the pressure divider is able to perform a large pressure drop.

Abstract: Present invention involves a seal means suitable to replace the classic seals. For instance the seal means of present invention can be a liquid seal ring (7) to replace the classic rubber seal rings. Such is liquid O-ring can be adapted to resists the actuation pressure relying on surface tension forces. Such liquid O-rings can also be linked in series, hereby increasing the maximum seal pressure. In a preferred embodiment the seal means of present invention comprises two major components, a surface tension seal (7) and a pressure divider (4). The pressure divider will comprise a system that generates a pressure drop. Such pressure divider can be located before the surface tension seal and perform the first pressure drop. The combination of these two systems has the advantage that the surface tension seal is able to reduce the leakage to zero or essentially zero and that the pressure divider is able to perform a large pressure drop.