Abstract: A device is disclosed including a substrate and a floating blinded infrared detector and/or a shunted blinded infrared detector. The floating blinded infrared detector may include an infrared detector coupled to and thermally isolated from the substrate; and a blocking structure disposed above the infrared detector to block external thermal radiation from being received by the infrared detector; and wherein the blocking structure comprises a plurality of openings. The shunted blinded infrared detector may include an additional infrared detector coupled to the substrate; an additional blocking structure disposed above the infrared detector to block external thermal radiation from being received by the additional infrared detector; and a material that thermally couples the additional infrared detector to the substrate and the additional blocking structure. Methods for using and forming the device are also disclosed.

Abstract: A device is disclosed including a substrate and a floating blinded infrared detector and/or a shunted blinded infrared detector. The floating blinded infrared detector may include an infrared detector coupled to and thermally isolated from the substrate; and a blocking structure disposed above the infrared detector to block external thermal radiation from being received by the infrared detector; and wherein the blocking structure comprises a plurality of openings. The shunted blinded infrared detector may include an additional infrared detector coupled to the substrate; an additional blocking structure disposed above the infrared detector to block external thermal radiation from being received by the additional infrared detector; and a material that thermally couples the additional infrared detector to the substrate and the additional blocking structure. Methods for using and forming the device are also disclosed.

Abstract: A method for forming an improved chamber for a micro-electromechanical device includes depositing a sacrificial layer on a substrate; depositing a masking layer on a surface of the sacrificial layer; removing at least one predetermined portion of the masking layer down to the sacrificial layer to form an etch pattern; isotropically etching the etch pattern into the sacrificial layer to a partial depth thereof and partially undercutting a remaining portion of the mask material; anisotropically etching the etch pattern into the sacrificial layer to the substrate to form a recessed pattern in the sacrificial layer with at least one anchor region on the substrate surrounding at least one plateau of sacrificial layer; removing the remaining masking layer; depositing a structural layer over the at least one plateau and filling the recessed pattern; providing an access port to the sacrificial layer; and removing the remaining sacrificial layer.

Abstract: PROBLEM TO BE SOLVED: To enhance ink ejection efficiency by deforming a diaphragm, constituting a part of an ink carrying path communicating with a nozzle at the forward end, gradually toward the nozzle from the rear of the ink carrying path thereby producing an unidirectional ink flow. SOLUTION: A diaphragm 55 constituting a part of an ink carrying path 51 communicating with a nozzle 54 and an electrode 72 facing the diaphragm are divided, between an ink supply chamber 52 and the nozzle 54, into a plurality of individual electrodes 72a-72c which are connected with a head ejection drive section 105 through respective terminals 74. The diaphragm 55 is displaced from the rear side by applying a voltage sequentially, at a constant time interval, to the individual electrodes 72a-72c starting from the rear electrode 72c close to the ink supply chamber 52.

Abstract: A method of manufacturing a pump [10] for pumping various primary fluids. A body is formed from silicon dies [102,104]. A primary fluid channel [110] is formed in the body and a primary fluid supply [122] is coupled to the primary fluid channel [110] to supply a primary fluid to the primary fluid channel [110]. A mechanism for introducing a secondary fluid to an interface region of the primary fluid channel [110] is formed in the body. An energy delivery device is formed in the body to deliver energy to an interface between region between the primary fluid and the secondary fluid to create a thermal gradient along the fluid interface. The thermal gradient results in a surface tension gradient along the interface. The primary fluid will move to compensate for the surface tension gradient. Various semiconductor fabrication processes can be used to form the elements on the body.

Abstract: A pump(10) for pumping various primary fluids includes a body(100) having a primary fluid channel(110) defined therein, and a primary fluid supply is coupled to the primary fluid channel to supply a primary fluid to the primary fluid channel. A mechanism(130/132) is provided for introducing a secondary fluid to an interface region of the primary fluid channel to thereby define a fluid interface between the primary fluid and the secondary dry fluid in the interface region. An energy delivery(150/160) device delivers energy to the interface region to create a thermal gradient along the fluid interface. The thermal gradient results in a surface tension gradient along the interface. The primary fluid will move to compensate for the surface tension gradient.