Abstract: A method for forming a light-emitting device, a non-transitory computer storage medium storing instructions for manufacturing and a light-emitting device that improve the reliability of light-emitting diode (LED) systems. The reliability is improved by: attaching a printed circuit board (PCB) to a heat sink, then attaching a top contact LED to the same heat sink, and electrically connecting the PCB to the LED using conductive elements, such as wires that may be bent upwards or downwards. This comprehensive approach not only ensures efficient heat management and electrical connectivity but also protects and isolates the conductive elements, enhancing the durability and performance of the light-emitting device.

Abstract: The invention refers to a method for assembling at least one lighting element onto a substrate, the method comprising: pre-assembling at least one lighting element onto a temporary carrier; pre-assembling at least one reference element onto the temporary carrier; aligning the pre-assembled temporary carrier onto the substrate based, at least in part, on the at least one reference element of the temporary carrier; and mounting the at least one lighting element onto the substrate. The invention further relates to substrate comprising: at least one lighting element, wherein the at least one lighting element is assembled onto the substrate, in particular by a method according to the first aspect of the present invention, and to a use of a method for assembling at least one lighting element onto a substrate.

Abstract: A composite array has two two-dimensional arrays on a substrate each having two rows of LEDs. The LEDs in each array have the same orientation as all other LEDs in that array. First electrical traces sequentially couple LEDs in the first string and the second string by beginning at opposite corners of the composite array and alternating between rows of each of the first and second arrays. A second electrical trace couples ends of the first and second strings across rows of the composite array. Third electrical traces route outside the composite array and are coupled, respectively, to a beginning of the first string for the row of the composite array containing the beginning of the first string, a beginning of the second string for the other row, the end of the first LED string for the other row, and electrodes of LEDs in the other row.

Abstract: The invention refers to a method for assembling at least one lighting element onto a substrate, the method comprising: pre-assembling at least one lighting element onto a temporary carrier; pre-assembling at least one reference element onto the temporary carrier; aligning the pre-assembled temporary carrier onto the substrate based, at least in part, on the at least one reference element of the temporary carrier; and mounting the at least one lighting element onto the substrate. The invention further relates to substrate comprising: at least one lighting element, wherein the at least one lighting element is assembled onto the substrate, in particular by a method according to the first aspect of the present invention, and to a use of a method for assembling at least one lighting element onto a substrate.

Abstract: An LED array assembly may include a hybridized device and a flexible PCB. The hybridized device may include a micro-LED array mounted on a driver IC. The driver IC may include driver IC contact pads on a top surface of the driver IC. The flexible PCB may have a bottom surface, first contact pads on the bottom surface, second contact pads on the bottom surface, and contact bridges. Each of the contact bridges extends from one of the first contact pads to one of the second contact pads. Each of the driver IC contact pads is bonded to a corresponding one of the first contact pads of the flexible PCB.

Abstract: A composite array has two two-dimensional arrays on a substrate each having two rows of LEDs. The LEDs in each array have the same orientation as all other LEDs in that array. First electrical traces sequentially couple LEDs in the first string and the second string by beginning at opposite corners of the composite array and alternating between rows of each of the first and second arrays. A second electrical trace couples ends of the first and second strings across rows of the composite array. Third electrical traces route outside the composite array and are coupled, respectively, to a beginning of the first string for the row of the composite array containing the beginning of the first string, a beginning of the second string for the other row, the end of the first LED string for the other row, and electrodes of LEDs in the other row.

Abstract: A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

Abstract: The invention describes an LED lighting arrangement comprising a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; at least one LED string comprising a plurality of series-connected LED die packages mounted on the mounting surface, wherein the LED die packages of a string are arranged in a two-dimensional array comprising at least two rows; and at least one micro-via extending through the dielectric layer of the single-layer carrier and arranged to electrically connect the final cathode of an LED string to the metal core of the single-layer carrier. The invention further describes a lighting unit; and a method of manufacturing an LED lighting arrangement.

Abstract: A lighting device, a method of manufacturing a lighting device and a support are described. A support includes a layered structure of alternating conductors and insulating layers. The layered structure includes a mounting section and a body section adjacent the mounting section. The mounting section includes at least one mounting face that has an arrangement direction and at least three alternating contact sections along the arrangement direction. Each contact section is electrically coupled to one of the conductors and separated from a neighboring one of the contact sections by one of the insulating layers. The body section has a width that protrudes sidewards from the at least one mounting face and a length that extends substantially parallel to the arrangement direction.

Abstract: The invention refers to a carrier for at least one lighting module, the carrier comprising: at least one mounting portion for receiving the at least one lighting module, wherein the carrier has a triangular cross section at least in sections with the at least one mounting portion being arranged on an edge of the triangular cross section; and a heat sink body portion arranged adjacent to the at least one mounting portion, wherein the heat sink body portion protrudes sidewards from the at least one mounting portion. The invention further relates to a lighting device and a method for producing such lighting device.

Abstract: A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

Abstract: A lighting device and a method of manufacturing a lighting device are described. A lighting device includes a flat carrier that has a front surface and a rear surface opposite the front surface. The flat carrier includes a cutout and multiple carrier-side electrical contacts on the rear surface. A mounting element is provided on the rear surface of the flat carrier and includes multiple mount-side electrical contacts electrically coupled to the multiple carrier-side electrical contacts and an elevated portion projecting into the cutout. Multiple LED elements are provided on the elevated portion of the mounting element and electrically coupled to the mounting element on the same side as the multiple mount-side side electrical contacts. A heat sink element is thermally coupled to the mounting element on a side of said mounting element opposite the flat carrier.

Abstract: The invention refers to a carrier for at least one lighting module, the carrier comprising: at least one mounting portion for receiving the at least one lighting module, wherein the carrier has a triangular cross section at least in sections with the at least one mounting portion being arranged on an edge of the triangular cross section; and a heat sink body portion arranged adjacent to the at least one mounting portion, wherein the heat sink body portion protrudes sidewards from the at least one mounting portion. The invention further relates to a lighting device and a method for producing such lighting device.

Abstract: A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

Abstract: A lighting device is provided comprising at least one light-emitting element comprising a light-emitting surface configured to emit light; and a light-guiding sheet at least partially covering the light-emitting surface and comprising at least one cavity forming a passage for light emitted from the light-emitting surface. Thereby, at least one lateral surface limiting the at least one cavity is configured to reflect light emitted from the light-emitting surface. Further, a size of an opening of the at least one cavity facing the light-emitting surface is smaller than an area of the light-emitting surface.

Abstract: A lighting device is provided comprising at least one light-emitting element comprising a light-emitting surface configured to emit light; and a light-guiding sheet at least partially covering the light-emitting surface and comprising at least one cavity forming a passage for light emitted from the light-emitting surface. Thereby, at least one lateral surface limiting the at least one cavity is configured to reflect light emitted from the light-emitting surface. Further, a size of an opening of the at least one cavity facing the light-emitting surface is smaller than an area of the light-emitting surface.

Abstract: A lighting device and a method of manufacturing a lighting device are described. A lighting device includes a flat carrier that has a front surface and a rear surface opposite the front surface. The flat carrier includes a cutout and multiple carrier-side electrical contacts on the rear surface. A mounting element is provided on the rear surface of the flat carrier and includes multiple mount-side electrical contacts electrically coupled to the multiple carrier-side electrical contacts and an elevated portion projecting into the cutout. Multiple LED elements are provided on the elevated portion of the mounting element and electrically coupled to the mounting element on the same side as the multiple mount-side side electrical contacts. A heat sink element is thermally coupled to the mounting element on a side of said mounting element opposite the flat carrier.

Abstract: The invention describes an LED lighting arrangement comprising a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; at least one LED string comprising a plurality of series-connected LED die packages mounted on the mounting surface, wherein the LED die packages of a string are arranged in a two-dimensional array comprising at least two rows; and at least one micro-via extending through the dielectric layer of the single-layer carrier and arranged to electrically connect the final cathode of an LED string to the metal core of the single-layer carrier. The invention further describes a lighting unit; and a method of manufacturing an LED lighting arrangement.

Abstract: A lighting device, a method of manufacturing a lighting device and a support are described. A support includes a layered structure of alternating conductors and insulating layers. The layered structure includes a mounting section and a body section adjacent the mounting section. The mounting section includes at least one mounting face that has an arrangement direction and at least three alternating contact sections along the arrangement direction. Each contact section is electrically coupled to one of the conductors and separated from a neighboring one of the contact sections by one of the insulating layers. The body section has a width that protrudes sidewards from the at least one mounting face and a length that extends substantially parallel to the arrangement direction.

Abstract: A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.