Patents by Inventor Michael Desmith

Michael Desmith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070150197
    Abstract: Method and apparatus to control delay between lanes in an I/O interface is disclosed. To control the delay between the lanes in the I/O system a programmed delay may be determined and introduced between the lanes. For this purpose the effective time “T” of the lanes is determined. The number of lanes “N” in the I/O interface is identified. The programmed lane to lane delay “D” is determined and a delay circuit having the programmed delay may be introduced between the lanes to reduce AC peak to peak noise in the I/O system.
    Type: Application
    Filed: December 28, 2005
    Publication date: June 28, 2007
    Inventors: Srikrishnan Venkataraman, Jayashree Kar, Sudarshan Solanki, P. Patel, Michael DeSmith, David Figueroa
  • Publication number: 20060189059
    Abstract: A plurality of N-doped strip portions are formed alternating with a plurality of P-doped regions. When a voltage is applied to the N-doped strip portions, a capacitance is created between the N-doped strip portions and the P-doped strip portions. A capacitance is also created between the N-doped strip portions and the underlying epitaxial silicon layer. A larger interface area between N-doped and P-doped regions generally increases the capacitance. By providing the N-doped strip portions, as opposed to a continuous N-doped region, the combined interface area between the N-doped strip portions and the underlying epitaxial silicon layer is reduced. However, more interface area is provided between the N-doped strip portions and the P-doped strip portions. A circuit simulation indicates that junction capacitance per unit peripheral length is 0.41 fF/?m, while the junction capacitance per unit area is 0.19 fF/?mˆ2.
    Type: Application
    Filed: February 23, 2005
    Publication date: August 24, 2006
    Inventors: Jung Kang, Peter Jeng, Michael DeSmith, Md Hossain, Yi-feng Liu
  • Publication number: 20060091564
    Abstract: According to some embodiments, a system includes an integrated circuit package to support an integrated circuit die. The integrated circuit package may include a plurality of conductive contacts and a decoupling capacitor. The decoupling capacitor may include a positive terminal contact pad coupled to a first one of the plurality of conductive contacts, the positive terminal contact pad comprising a first substantially non-conductive area, and a negative terminal contact pad coupled to a second one of the plurality of conductive contacts, the negative terminal contact pad comprising a second substantially non-conductive area.
    Type: Application
    Filed: October 29, 2004
    Publication date: May 4, 2006
    Inventors: Dong Zhong, David Figueroa, Yuan-Liang Li, Michael Desmith
  • Publication number: 20050194675
    Abstract: According to some embodiments, a device includes a first conductive plane electrically coupled to a first terminal associated with a first polarity and a second terminal associated with the first polarity, a second conductive plane electrically coupled to a third terminal associated with a second polarity, and a dielectric disposed between the first conductive plane and the second conductive plane. A first capacitance is present between the first terminal and the third terminal, a second capacitance is present between the second terminal and the third terminal, and the first capacitance and the second capacitance may be substantially dissimilar.
    Type: Application
    Filed: April 12, 2005
    Publication date: September 8, 2005
    Inventors: Jennifer Hester, Yuan-Liang Li, Michael Desmith, David Figueroa, Dong Zhong