Abstract: A device may include an input port; a RF output port; a RF amplifier device; and an off mode output impedance control.

Abstract: A transistor device package includes a transistor die comprising a gate terminal, a drain terminal, and a source terminal, and a passive component assembly including the transistor die on a surface thereof and comprising one or more passive electrical components electrically coupled to the gate terminal, the drain terminal, and/or the source terminal. A mold structure may be provided on the one or more passive electrical components. One or more conductive pads may be exposed by the mold structure. A support structure may extend along one or more sides of the transistor die on the surface of the passive component assembly. The support structure may provide a cavity that extends around the transistor die, and/or may be thermally conductive. Related devices and component assemblies are also discussed.

Abstract: A method of fabricating a semiconductor device includes forming a protective structure on at least one die on a substrate. The protective structure exposes one or more electrical contacts on a first surface of the at least one die. Respective terminals are formed on the one or more electrical contacts exposed by the protective structure. Related packages and fabrication methods are also discussed.

Abstract: A transistor amplifier includes a die comprising a gate terminal, a drain terminal, and a source terminal, a circuitry module on the transistor die and electrically coupled to the gate terminal, the drain terminal, and/or the source terminal, and one or more passive electrical components on a first surface of the circuitry module. The one or more passive electrical components are electrically coupled between the gate terminal and a first lead of the transistor amplifier and/or between the drain terminal and a second lead of the transistor amplifier.

Abstract: In accordance with the present invention, there is provided a CPV module wherein a solder paste is used as an alternative to wire bonds or braided ribbon/mesh connectors to facilitate the electrical connectivity between the concentrated photovoltaic receiver cell or die of the CPV module and the conductive pattern of the underlying substrate thereof. In accordance with the present invention, the possibility of accidentally shorting the top of the receiver die with the other metal parts of the CPV module is avoided by molding at least the periphery of the receiver die with a mold body, and then dispensing or printing the conductive paste between the top of the receiver die and the substrate, the mold body defining a reservoir which facilities the flow of the conductive paste in a prescribed pattern.