Abstract: Various systems and methods are provided for surgical and interventional planning, support, post-operative follow-up, and functional recovery tracking. In general, a patient can be tracked throughout medical treatment including through initial onset of symptoms, diagnosis, non-surgical treatment, surgical treatment, and recovery from the surgical treatment. In one embodiment, a patient and one or more medical professionals involved with treating the patient can electronically access a comprehensive treatment planning, support, and review system. The system can provide recommendations regarding diagnosis, non-surgical treatment, surgical treatment, and recovery from the surgical treatment based on data gathered from the patient and the medical professional(s).

Abstract: A rebar sleeve device comprising a tubular unit with an opening at least one end thereof for receipt of a rebar dowel is described. The tubular unit is typically positioned horizontally and can be elevated by a back extension component and a front extension component secured to the base unit. The front extension component comprises an opening through which the rebar dowel is inserted. The opening of the front extension component comprises a protective covering. The protective covering prevents concrete from filling in the opening, but allows for the insertion of a rebar dowel. A connection component connects a plurality of the rebar sleeve devices together to form a single unit.

Abstract: An architecture is presented that provides a rebar sleeve device. The rebar sleeve device comprises a tubular unit with an opening at atleast one end thereof for receipt of a rebar dowel. The tubular unit is typically positioned horizontally and can be elevated by a back extension component and a front extension component secured to the base unit. The front extension component comprises an opening through which the rebar dowel is inserted. The opening of the front extension component comprises a protective covering. The protective covering prevents concrete from filling in the opening, but allows for the insertion of a rebar dowel. A connection component connects a plurality of the rebar sleeve devices together to form a single unit.

Abstract: A hail-resistant roofing membrane includes a flexible waterproof polymeric layer of material, a flexible layer of non-woven fabric joined throughout the area of a first surface thereof to the polymeric layer, and a flexible layer of foam material joined throughout the area of a first surface thereof to a second surface of the layer of non-woven fabric, the layer of foam material being adapted for attachment to a roof surface throughout the area of a second surface of the layer of foam material. The roofing membrane is adapted for attachment to an existing roof structure. A method for making the membrane includes binding the polymeric layer, the non-woven fabric layer, and the layer of foam material together with the fabric layer disposed between the polymeric layer and the foam material.

Abstract: A socket for testing an integrated circuit ball grid array package having external contacts formed by an array of solder balls is formed with a flexible bladder in the socket bottom. The upper side of the bladder has a test contact pattern that matches the pattern of the solder balls on the package. The side of the bladder carrying the test contact pattern is formed of conventional flexible circuit tape having contacts of spherical, conical or cylindrical shape formed thereon by conventional techniques, with circuit traces also formed on the flexible circuit tape extending to the outside of the socket for connection to test circuitry. Inflation of the bladder drives its test contact pattern against the solder balls of a package held in the socket and forces the flexible test contact substrate of the bladder to conform to any non-planar configuration of the ball grid array.

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.