Patents by Inventor Michael Doogue

Michael Doogue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7709754
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: May 4, 2010
    Assignee: Allegro Microsystems, Inc.
    Inventors: Michael Doogue, Richard Dickinson, Jay Gagnon
  • Publication number: 20070279053
    Abstract: An integrated current sensor includes a current conductor, a magnetic field transducer, and an electromagnetic shield. The magnetic field transducer includes a sensor die. The electromagnetic shield is disposed proximate to the sensor die. The electromagnetic shield has at least one feature selected to reduce an eddy current in the electromagnetic shield.
    Type: Application
    Filed: July 11, 2007
    Publication date: December 6, 2007
    Inventors: William Taylor, John Cummings, Michael Doogue, Jay Gagnon, Vijay Mangtani, Nirmal Sharma
  • Publication number: 20070170533
    Abstract: An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
    Type: Application
    Filed: January 20, 2006
    Publication date: July 26, 2007
    Inventors: Michael Doogue, William Taylor, Vijay Mangtani
  • Publication number: 20060255797
    Abstract: A method and apparatus provide a substrate having a depression into which a magnetic material is disposed, forming a magnetic flux concentrator and/or a permanent magnet. A magnetic field sensing element can be disposed proximate to the depression.
    Type: Application
    Filed: May 16, 2005
    Publication date: November 16, 2006
    Inventors: William Taylor, Richard Dickinson, Michael Doogue
  • Publication number: 20060219436
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.
    Type: Application
    Filed: May 12, 2006
    Publication date: October 5, 2006
    Inventors: William Taylor, Michael Doogue, Nirmal Sharma, Jay Gagnon, Vijay Mangtani
  • Publication number: 20060181263
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The lead frame also includes a shunt conductor portion formed as a coupling of the at least two leads.
    Type: Application
    Filed: April 10, 2006
    Publication date: August 17, 2006
    Inventors: Michael Doogue, Vijay Mangtani, William Taylor
  • Publication number: 20060175674
    Abstract: An integrated sensor has a magnetic field sensing element and first and second relatively high magnetically permeable members forming a gap, wherein the magnetic field element is disposed within the gap. The magnetically permeable members provide an increase in the flux experienced by the magnetic field sensing element in response to a magnetic field. The integrated sensor can be used as a current sensor, a proximity detector, or a magnetic field sensor.
    Type: Application
    Filed: February 4, 2005
    Publication date: August 10, 2006
    Inventors: William Taylor, Richard Dickinson, Michael Doogue
  • Publication number: 20060152210
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The integrated circuit includes an overcurrent circuit responsive to a voltage drop generated by a current.
    Type: Application
    Filed: January 20, 2006
    Publication date: July 13, 2006
    Inventors: Vijay Mangtani, Michael Doogue, William Taylor
  • Publication number: 20060077598
    Abstract: A material stack has an electrical resistance generally the same in the presence of a magnetic field and in the presence of no magnetic field. The electrical resistance of the material stack has a temperature coefficient generally the same as a magnetoresistance element.
    Type: Application
    Filed: October 12, 2004
    Publication date: April 13, 2006
    Inventors: William Taylor, Michael Doogue
  • Patent number: 6995315
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited on a surface of the substrate proximate to the one or more magnetic field sensors.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: February 7, 2006
    Assignee: Allegro Microsystems, Inc.
    Inventors: Nirmal Sharma, Richard Dickinson, Michael Doogue, Jay Gagnon
  • Publication number: 20050248336
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited on a surface of the substrate proximate to the one or more magnetic field sensors.
    Type: Application
    Filed: May 27, 2005
    Publication date: November 10, 2005
    Inventors: Nirmal Sharma, Richard Dickinson, Michael Doogue, Jay Gagnon
  • Publication number: 20050224248
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. A current conductor portion can be deposited proximate to a surface of the substrate and proximate to the one or more magnetic field sensors.
    Type: Application
    Filed: June 3, 2005
    Publication date: October 13, 2005
    Inventors: Jay Gagnon, Richard Dickinson, Michael Doogue, Andreas Friedrich, William Taylor
  • Publication number: 20050225319
    Abstract: Apparatus for detecting vibration of an object adapted to rotate includes one or more vibration processors selected from: a direction-change processor adapted to detect changes in a direction of rotation of the object, a direction-agreement processor adapted to identify a direction of rotation of the object in at least two channels and identify an agreement or disagreement in direction of rotation identified by the at least two channels, a phase-overlap processor adapted to identify overlapping signal regions in signals associated with the rotation of the object, and a running mode processor adapted to identify an unresponsive output signal from at least one of the at least two channels.
    Type: Application
    Filed: September 16, 2004
    Publication date: October 13, 2005
    Inventors: James Bailey, Michael Doogue, Jay Towne
  • Publication number: 20050225318
    Abstract: Apparatus for detecting vibration of an object adapted to rotate includes one or more vibration processors selected from: a direction-change processor adapted to detect changes in a direction of rotation of the object, a direction-agreement processor adapted to identify a direction of rotation of the object in at least two channels and identify an agreement or disagreement in direction of rotation identified by the at least two channels, and a phase-overlap processor adapted to identify overlapping signal regions in signals associated with the rotation of the object. A method for detecting the vibration of the object includes generating at least one of a direction-change output signal with the direction-change processor, generating a direction-agreement output signal with the direction-agreement processor, and generating a phase-overlap output signal with the phase-overlap processor, each indicative of the vibration of the object.
    Type: Application
    Filed: April 8, 2004
    Publication date: October 13, 2005
    Inventors: James Bailey, Michael Doogue, Jay Towne
  • Publication number: 20050045359
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity.
    Type: Application
    Filed: August 26, 2003
    Publication date: March 3, 2005
    Inventors: Michael Doogue, Richard Dickinson, Jay Gagnon