Patents by Inventor Michael Duignan

Michael Duignan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for forming high resolution electronic circuits on a substrate
    Publication number: 20090123661
    Abstract: A system and method for forming high resolution electronic circuits on a substrate is provided. The system (10) includes a substrate (12), a source of radiant energy (34) and a focusing means (16). The source of radiant energy (34) directs an energy beam (14) through the focusing means (16) in order to direct a focused energy beam (18) onto the surface of the substrate (12). The focused energy beam (18) creates a plurality of channels (20) in the surface of the substrate (12). A paste applicator (22) fills the channels (20) with an electrically conductive paste (24). Once heated and cured, the electrically conductive paste (24) makes up the electrically conductive pathways of the electronic circuit.
    Type: Application
    Filed: January 6, 2009
    Publication date: May 14, 2009
    Inventors: Christopher Wargo, Scott Mathews, Paul Kydd, Todd A. Kegresse, Chengping Zhang, Michael Duignan, Susan Gordon
  • System and method for forming high resolution electronic circuits on a substrate
    Publication number: 20060118233
    Abstract: A system and method for forming high resolution electronic circuits on a substrate is provided. The system (10) includes a substrate (12), a source of radiant energy (34) and a focusing means (16). The source of radiant energy (34) directs an energy beam (14) through the focusing means (16) in order to direct a focused energy beam (18) onto the surface of the substrate (12). The focused energy beam (18) creates a plurality of channels (20) in the surface of the substrate (12). A paste applicator (22) fills the channels (20) with an electrically conductive paste (24). Once heated and cured, the electrically conductive paste (24) makes up the electrically conductive pathways of the electronic circuit.
    Type: Application
    Filed: January 5, 2006
    Publication date: June 8, 2006
    Inventors: Christopher Wargo, Scott Mathews, Paul Kydd, Todd Kegresse, Chengping Zhang, Michael Duignan, Susan Gordon
  • Method of forming high resolution electronic circuits on a substrate
    Patent number: 7014727
    Abstract: A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in the dielectric film (14) and the substrate (12), and filling channels (16 and 18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: March 21, 2006
    Assignees: Potomac Photonics, Inc., Parelec, Inc.
    Inventors: Christopher Wargo, Paul Kydd, Scott Mathews, Susan Gordon, legal representative, Chengping Zhang, Todd A. Kegresse, Michael Duignan, deceased
  • Method of forming high resolution electronic circuits on a substrate
    Publication number: 20050006335
    Abstract: A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in the dielectric film (14) and the substrate (12), and filling channels (16 and 18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).
    Type: Application
    Filed: July 7, 2003
    Publication date: January 13, 2005
    Inventors: Christopher Wargo, Paul Kydd, Scott Mathews, Michael Duignan, Susan Gordon, Chengping Zhang, Todd Kegresse