Patents by Inventor Michael E. Ahrens

Michael E. Ahrens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7457126
    Abstract: According to embodiments of the present invention, an optical transponder module generates heat when operating and a heat pipe disposed in the module body performs active heat transfer from a hot end of the optical transponder module to a cooler end of the optical transponder module. A heat pipe disposed in an external clip-in heat sink may remove heat from the optical transponder body.
    Type: Grant
    Filed: June 27, 2005
    Date of Patent: November 25, 2008
    Assignee: Intel Corporation
    Inventor: Michael E. Ahrens
  • Patent number: 7290945
    Abstract: According to one embodiment of the invention, a system comprising a housing including an opening to receive an optical connector, and an electromagnetic inductive (EMI) shield independent of the optical connector to cover a portion of the opening to reduce emissions of EMI radiation generated by the optical connector from the transceiver housing. According to another embodiment of the invention, a method comprising connecting an optical connecter to an optical port of a housing in an optical module, the housing comprising an opening to receive to the optical connector; and shielding a portion of an opening in the housing to reduce emissions of EMI radiation generated by the optical connector from the housing.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: November 6, 2007
    Assignee: Intel Corporation
    Inventors: Michael E. Ahrens, Roger Viet
  • Patent number: 7229221
    Abstract: According to embodiments of the present invention, an optical transponder module generates heat when operating and at least a copper heat wick and/or a copper block are disposed in the module body to perform passive transfer of heat from inside the optical transponder module to outside the optical transponder module. The heat wick may be soldered to thermal vias in the printed circuit board that is internal to the optical transponder module and positioned over the laser transmitter circuitry. The copper block may be positioned in a cutout in the optical transponder module body to acts as a heat spreader. Thermal grease, compounds, paste, interface material, etc., may be used to help the conduction of heat.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: June 12, 2007
    Assignee: Intel Corporation
    Inventor: Michael E. Ahrens
  • Patent number: 6789958
    Abstract: A release mechanism for manually securing a pluggable fiber optic transceiver to a cage mounted on a host circuit board. The release mechanism includes a pivoting faceplate connected to a transceiver housing such that the faceplate is rotatable from a first position in which the faceplate is positioned over a front surface of the housing to a second position in which the faceplate is pivoted away from the front surface of the housing. The release mechanism also includes a lever that disengages a boss from an opening formed in a resilient transceiver latch of the cage when the faceplate is in the second position. In one embodiment the boss is mounted on the housing, and the lever pushes the transceiver latch away from the boss. In another embodiment, the boss is mounted on the lever.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: September 14, 2004
    Assignee: Infineon Technologies AG
    Inventors: Michael E. Ahrens, Neil P. Cannon
  • Patent number: 6533470
    Abstract: A cage for mounting a pluggable fiber optic transceiver onto a host circuit board. The cage is entirely formed from a single blank, which is folded along predefined fold lines to form top, bottom, and side walls that are secured by a latch. A series of semi-resilient feet extend downward from the cage and are pressed into corresponding plated holes provided in the host circuit board such that the cage is secured to the circuit board without soldering. The feet are integrally formed on the blank during the blank stamping process such that they extend perpendicular to the bottom wall after the folding process. Each foot is has an elongated oval outer edge and defines an eye-shaped opening that facilitates resilient deformation when pressed into the plated holes of the host circuit board.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: March 18, 2003
    Assignee: Infineon Technologies North America Corp.
    Inventor: Michael E. Ahrens
  • Publication number: 20030044129
    Abstract: A release mechanism for manually securing a pluggable fiber optic transceiver to a cage mounted on a host circuit board. The release mechanism includes a pivoting faceplate connected to a transceiver housing such that the faceplate is rotatable from a first position in which the faceplate is positioned over a front surface of the housing to a second position in which the faceplate is pivoted away from the front surface of the housing. The release mechanism also includes a lever that disengages a boss from an opening formed in a resilient transceiver latch of the cage when the faceplate is in the second position. In one embodiment the boss is mounted on the housing, and the lever pushes the transceiver latch away from the boss. In another embodiment, the boss is mounted on the lever.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventors: Michael E. Ahrens, Neil P. Cannon
  • Patent number: 6494623
    Abstract: A release mechanism for manually securing a pluggable fiber optic transceiver to a cage mounted on a host circuit board. The transceiver is secured to the cage by a boss extending from a lower wall of the transceiver housing that is received in an opening formed in a resilient transceiver latch of the cage. The release mechanism includes a locking mechanism including a shaft rotatably connected to the transceiver body, a lever extending from a front end of the transceiver body and connected to a first end of the shaft, and a cam mounted at a rear end of the shaft adjacent to the locking mechanism. When the lever is manually rotated, the cam pushes the transceiver latch away from the boss, thereby allowing the transceiver to be pulled from the cage by the lever.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: December 17, 2002
    Assignee: Infineon Technologies AG
    Inventors: Michael E. Ahrens, Andreas H. Dannenberg
  • Publication number: 20020131725
    Abstract: A cage for mounting a pluggable fiber optic transceiver onto a host circuit board. The cage is entirely formed from a single blank, which is folded along predefined fold lines to form top, bottom, and side walls that are secured by a latch. A series of semi-resilient feet extend downward from the cage and are pressed into corresponding plated holes provided in the host circuit board such that the cage is secured to the circuit board without soldering. The feet are integrally formed on the blank during the blank stamping process such that they extend perpendicular to the bottom wall after the folding process. Each foot is has an elongated oval outer edge and defines an eye-shaped opening that facilitates resilient deformation when pressed into the plated holes of the host circuit board.
    Type: Application
    Filed: March 16, 2001
    Publication date: September 19, 2002
    Inventor: Michael E. Ahrens