Patents by Inventor Michael E. Buckwalter

Michael E. Buckwalter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5635266
    Abstract: Vinyl heat welding rod for seam sealing vinyl resilient flooring, whether in sheet or tile form, are used to obtain a homogeneous, monolithic appearing surface. This rod is specifically made to duplicate the appearance of the flooring material. For a chip-image flooring structure, a sheet of multicolored chips having a similar, but different formulation from that of the flooring material is prepared and the sheet is cut into suitable strips, heat pressed in a rod mold, end adhered or further molded to form the desired length, and used as a vinyl heat welding rod for sealing seams in flooring. Thus, the chip pattern is evident in the seam area and does not appear different when compared to the adjacent surface.
    Type: Grant
    Filed: November 16, 1992
    Date of Patent: June 3, 1997
    Assignee: Armstrong World Industries, Inc.
    Inventors: Edwin J. Quinn, Manuel A. Velez, Richard M. Ringer, Michael E. Buckwalter