Patents by Inventor Michael E. Chandross

Michael E. Chandross has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diamond-like carbon films and uses thereof
    Patent number: 10941485
    Abstract: The present invention relates to methods of forming a film between two surfaces, in which the film includes diamond-like carbon. Also provided herein are uses of such films, such in sliding contacts and in metal coatings.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: March 9, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Nicolas Argibay, Michael T. Dugger, Michael E. Chandross, Tomas Farley Babuska, Brendan L. Nation, John Curry
  • Stable nanocrystalline metal alloy coatings with ultra-low wear
    Patent number: 10763000
    Abstract: The present invention relates to metal coatings and methods thereof. In certain embodiments, the invention relates to ultra-low wear noble metal alloys, such as for use in electrical contact coatings.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: September 1, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Nicolas Argibay, Michael E. Chandross, David P. Adams, Michael T. Dugger, Blythe G. Clark, Brad L. Boyce, Ping Lu
  • DIAMOND-LIKE CARBON FILMS AND USES THEREOF
    Publication number: 20190352773
    Abstract: The present invention relates to methods of forming a film between two surfaces, in which the film includes diamond-like carbon. Also provided herein are uses of such films, such in sliding contacts and in metal coatings.
    Type: Application
    Filed: May 21, 2019
    Publication date: November 21, 2019
    Inventors: Nicolas Argibay, Michael T. Dugger, Michael E. Chandross, Tomas Farley Babuska, Brendan L. Nation, John Curry
  • Low-temperature nanosolders
    Patent number: 9463532
    Abstract: A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: October 11, 2016
    Assignee: Sandia Corporation
    Inventors: Timothy J. Boyle, Ping Lu, Paul T. Vianco, Michael E. Chandross
  • Low-temperature Nanosolders
    Publication number: 20160023308
    Abstract: A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C.
    Type: Application
    Filed: October 5, 2015
    Publication date: January 28, 2016
    Inventors: Timothy J. Boyle, Ping Lu, Paul T. Vianco, Michael E. Chandross