Patents by Inventor Michael E. Fischer

Michael E. Fischer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
    Patent number: 7060533
    Abstract: A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup in an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: June 13, 2006
    Assignee: Wetherill Associates, Inc.
    Inventors: Bahman Roozrokh, Michael E. Fischer
  • Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
    Publication number: 20040014256
    Abstract: A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup in an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.
    Type: Application
    Filed: July 16, 2003
    Publication date: January 22, 2004
    Applicant: TRANSPO ELECTRONICS, INC.
    Inventors: Bahman Roozrokh, Michael E. Fischer
  • Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
    Patent number: 6642078
    Abstract: A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup in an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: November 4, 2003
    Assignee: Transpo Electronics, Inc.
    Inventors: Bahman Roozrokh, Michael E. Fischer
  • Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
    Publication number: 20020068411
    Abstract: A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup in an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.
    Type: Application
    Filed: August 13, 2001
    Publication date: June 6, 2002
    Applicant: Transpo Electronics, Inc.
    Inventors: Bahman Roozrokh, Michael E. Fischer