Abstract: An assembly includes a dielectric layer in contact with a semiconductor layer. The dielectric layer includes a crosslinked polymeric material having isocyanurate groups, wherein the dielectric layer is free of zirconium oxide particles. The semiconductor layer includes a non-polymeric organic semiconductor material, and is substantially free of electrically insulating polymer. Electronic components and devices including the assembly are also disclosed.

Abstract: An assembly includes a dielectric layer in contact with a semiconductor layer. The dielectric layer includes a cross-linked polymeric material having isocyanurate groups, wherein the dielectric layer is free of zirconium oxide particles. The semiconductor layer includes a non-polymeric organic semiconductor material, and is substantially free of electrically insulating polymer. Electronic components and devices including the assembly are also disclosed.

Abstract: The present disclosure provides a method of making a thin film semiconductor device such as a transistor comprising the steps of: a) providing a substrate bearing first and second conductive zones which define a channel therebetween, where the channel does not border more than 75% of the perimeter of either conductive zone; and b) depositing a discrete aliquot of a solution comprising an organic semiconductor adjacent to or on the channel, where a majority of the solution is deposited to one side of the channel and not on the channel. In some embodiments of the present disclosure, the solution is deposited entirely to one side of the channel, not on the channel, and furthermore the solution is deposited in a band having a length that is less than the channel length. The present disclosure additionally provides thin film semiconductor devices such as a transistors.

Abstract: The present disclosure provides a method of making a thin film semiconductor device such as a transistor comprising the steps of: a) providing a substrate bearing first and second conductive zones which define a channel therebetween, where the channel does not border more than 75% of the perimeter of either conductive zone; and b) depositing a discrete aliquot of a solution comprising an organic semiconductor adjacent to or on the channel, where a majority of the solution is deposited to one side of the channel and not on the channel. In some embodiments of the present disclosure, the solution is deposited entirely to one side of the channel, not on the channel, and furthermore the solution is deposited in a band having a length that is less than the channel length. The present disclosure additionally provides thin film semiconductor devices such as a transistors.

Abstract: A photon emitting device comprises a plurality of solid state radiation sources to generate radiation. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. A support structure is provided to stabilize the plurality of optical waveguides between the first and second ends. The photon emitting device can provide a replacement for a discharge lamp device in various applications including road illumination, spot lighting, back lighting, image projection and radiation activated curing.

Abstract: An electronic circuit structure having a reduced size includes a circuit substrate, an aperture extending through the circuit substrate, and an electronic component suspended within the aperture. The suspension of the electronic component within the aperture significantly reduces the profile of the overall electronic circuit structure. The aperture further enables electronic components to be mounted in a partially overlapping fashion to reduce the surface area of the electronic circuit structure. The electronic circuit structure can make use of standard FR-4, G-10, or ceramic circuit substrates or multilayer flex circuits, as well as electronic components in the form of standard leaded integrated circuit packages. The mounting of the electronic component within the aperture of the circuit substrate provides an advantage of assisting in heat dissipation. The incorporation of mesh-like voltage and ground planes can further aid in heat dissipation and provide electrical isolation and capacitive filtering.

Abstract: An electronic circuit structure having a reduced size includes a circuit substrate, an aperture extending through the circuit substrate, and an electronic component suspended within the aperture. The suspension of the electronic component within the aperture significantly reduces the profile of the overall electronic circuit structure. The aperture further enables electronic components to be mounted in a partially overlapping fashion to reduce the surface area of the electronic circuit structure. The electronic circuit structure can make use of standard FR-4, G-10, or ceramic circuit substrates or multilayer flex circuits, as well as electronic components in the form of standard leaded integrated circuit packages. The mounting of the electronic component within the aperture of the circuit substrate provides an advantage of assisting in heat dissipation. The incorporation of mesh-like voltage and ground planes can further aid in heat dissipation and provide electrical isolation and capacitive filtering.

Abstract: Apparatus for use with a fiber optic data channel includes a configuration block that determines the configuration of a communication port associated with the apparatus. The apparatus further includes multiplexer/transmitter for transmitting data and configuration information to a distant apparatus and a receiver/demultiplexer for receiving data and configuration information from the distant apparatus.

Abstract: A transmitter for a data communication system includes a self configuration register for storing information about the configuration of a local data communication port and a data input register for storing data received from the port to be transmitted and a multiplexer for multiplexing information stored in the self configuration register into configuration data packets and information stored in the data input register into message data packets and transmitting those data packets over an optical fiber. A receiver for a data communication system includes a demultiplexer, an-other configuration register and an output register. The demultiplexer receives data, demultiplexes it and stores it in the output register. The output register transmits information in configuration data packets to the other configuration register and information in message data packets to the local data port.

Abstract: Apparatus for use with a fiber optic data channel includes a configuration block that determines the configuration of a communication port associated with the apparatus. The apparatus further includes multiplexer/transmitter for transmitting data and configuration information to a distant apparatus and a receiver/demultiplexer for receiving data and configuration information from the distant apparatus.

Abstract: An optical fiber connector can be assembled without an adhesive using a known combination of a grooved mount and a sleeve that can either grip or release a stripped end of an optical fiber. The mount-sleeve combination is positioned within a housing which is open at one end to receive one or more stripped optical fibers and is formed at its other end with a tiny orifice that is radially aligned with a groove of the mount. After inserting a stripped optical fiber through the mount-sleeve combination and the orifice, the sleeve is allowed to grip the fiber, thus restraining it against longitudinal movement. Because of this restraint, the protruding portion of the fiber can be cleaved or polished along with the adjacent portions of the end cap. The housing preferably is formed by a thermoplastic shroud and a ceramic end cap in which the orifice is formed.

Abstract: A storage unit for knives and/or steels including a series of individual blocks pivotal forwardly within a frame from a generally upright storage position to an inclined access position. The frame and blocks are modular in construction, permitting widening of the frame and addition of blocks by the purchaser subsequent to his initial purchase.