Patents by Inventor Michael E. Griffith

Michael E. Griffith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Distributed electrostatic discharge protection for an on-package input/output architecture
    Patent number: 10374419
    Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: August 6, 2019
    Assignee: Intel Corporation
    Inventors: Todd W. Mellinger, Michael E. Griffith, Ganesh Balamurugan, Thomas P. Thomas
  • Non-linear termination for an on-package input/output architecture
    Patent number: 9384163
    Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: July 5, 2016
    Assignee: Intel Corporation
    Inventors: Todd W. Mellinger, Michael E. Griffith, Ganesh Balamurugan, Thomas P. Thomas, Rajesh Kumar
  • DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR AN ON-PACKAGE INPUT/OUTPUT ARCHITECTURE
    Publication number: 20160164281
    Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
    Type: Application
    Filed: February 12, 2016
    Publication date: June 9, 2016
    Inventors: Todd W. Mellinger, Michael E. Griffith, Ganesh Balamurugan, Thomas P. Thomas
  • Distributed electrostatic discharge protection for an on-package input/output architecture
    Patent number: 9306390
    Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 5, 2016
    Assignee: Intel Corporation
    Inventors: Todd W. Mellinger, Michael E. Griffith, Ganesh Balamurugan, Thomas P. Thomas
  • DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR AN ON-PACKAGE INPUT/OUTPUT ARCHITECTURE
    Publication number: 20140204490
    Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.
    Type: Application
    Filed: December 22, 2011
    Publication date: July 24, 2014
    Inventors: Todd W. Mellinger, Michael E. Griffith, Ganesh Balamurugan, Thomas P. Thomas
  • NON-LINEAR TERMINATION FOR AN ON-PACKAGE INPUT/OUTPUT ARCHITECTURE
    Publication number: 20140089549
    Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines arc matched.
    Type: Application
    Filed: December 22, 2011
    Publication date: March 27, 2014
    Inventors: Todd W. Mellinger, Michael E. Griffith, Ganesh Balamurugan, Thomas P. Thomas, Rajesh Kumar